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Flip-Chip Bonder for Small-sized Device
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Japan
Main Products:
Crystal oscillation manufacturing equipment
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Product information

  • 此设备是使用小型电子装置的US焊接(超声波)进行FC接合。
  • 提高超声波效率、使产品能在低温、短时间内接合。从而避免对产品造成机械性热残余压力,进而实现稳定、高质量的焊接。

  基本规格

项目                                                内容
型号AFM-15
类型150515081562
接合工法加热、超声波 / Heating , ultrasonic
适用产品LED、TCXO、SAW、RF、MEMS、CMOS 等
适用晶片MAX:2.5 W×2.5D×1.0T mm
MIN:0.3W×0.3D×0.1Tmm
(Option:20.0W×20.0D mm)
MAX:7.0 W×7.0D×1.0T mm
MIN:2.5 W×2.5D×0.1Tmm
(Option:20.0W×20.0D mm)
适用基板MAX:180W×120D×3.0Tmm
MIN:50W×50D×0.3Tmm
(Option:8inch wefer substrate)
MAX:170W×105D×3.0Tmm
MIN:50W×50D×0.3Tmm
MAX:180W×120D×3.0Tmm
MIN:50W×50D×0.3Tmm
(Option:12inch wefer substrate)
节拍时间0.78sec/Chip(含0.2秒处理时间)
(Including 0.2sec process time)
0.59sec/Chip(含0.16秒处理时间)
(Including 0.16sec process time)
1.35sec/Chip(含0.4秒处理时间)
(Including 0.4sec process time)
安装精度±7μm/3σ (Option:±5μm,±3μm)±5μm/3σ (Option:±3μm)
最大负载25N(选项/Option:50N , 100N ,200N ,500N)
晶片供给形态5,6,8,12英寸Wafer等/5",6",8",12"wafew-ring
(option:12 wafew-ring )
5,6英寸Wafer等/5",6"wafew-ring8,12英寸Wafer等/8",12"wafew-ring
自动上料收纳盒
/Automatic magazine Loader
自动上料收纳盒
/Automatic magazine Loader
自动上料收纳盒
/Automatic magazine Loader
机器尺寸1,200W×1,504D×1,650H mm980W×1,040D×1,860H mm1,980W×1,620D×1,566H mm
机器重量约1,800 kg约1,500 kg约2,100 kg
标准搭载功能预热工作台(加温)/ Preheating table(Warming)
安装工作台(加温)/ Mounting table(Warming)
吸嘴自动清洁 / Automated mounting nozzle cleaning
US管理 / Ultrasonic power monitoring
晶片高度测量 / Chip height measuring
凸点检测 / Bump detection
NG标记检测 / Detection of NG marking
Waferθ校正 / Adjustment for wafer rotational position
wafer扩展 / Wafer seet expander
热吹/ Hot air blower
吸嘴背面监视 / Monitorring of mounting nozzle tip condition
对应区域网 / LAN connection interface
吸嘴使用次数计数器 / frequency counter of use of mounting nozzle
管理生产信息 / Production data logging
选项及特殊功能上料、卸料用收纳盒 / Magazine , Loader and Unloader
除电鼓风机 / Neutralized air blower
HEPA过滤器 / HEPA filter
挡案监视器 / Mounting profile monitetor
对应晶片托盘 / Compatible with chip supply tray
地图数据 / Map data
吸嘴加热 / Mounting nozzle heater
基板(集成块)特殊抑制/ submount (or package) holder
安装检查 / OK/NG judgment
安装研磨喷嘴夹具 / Nozzle polishing Jig

※ 因改善、改良,规格、外观可能在无事先通知的情况下进行变更。

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