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Flip-Chip Bonder for Small-sized Device
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Price:
price negotiable
Brand Name:
PFA Country Region:
JapanModel No:
AFM-15
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PFA 
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Country: Japan
Main Products: Crystal oscillation manufacturing equipment
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Price:
price negotiable
Brand Name:
PFA Country Region:
JapanModel No:
AFM-15

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PFA 
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Japan
Main Products:
Crystal oscillation manufacturing equipment

Product information
- 此设备是使用小型电子装置的US焊接(超声波)进行FC接合。
- 提高超声波效率、使产品能在低温、短时间内接合。从而避免对产品造成机械性热残余压力,进而实现稳定、高质量的焊接。
基本规格
项目 | 内容 | ||
---|---|---|---|
型号 | AFM-15 | ||
类型 | 1505 | 1508 | 1562 |
接合工法 | 加热、超声波 / Heating , ultrasonic | ||
适用产品 | LED、TCXO、SAW、RF、MEMS、CMOS 等 | ||
适用晶片 | MAX:2.5 W×2.5D×1.0T mm MIN:0.3W×0.3D×0.1Tmm (Option:20.0W×20.0D mm) | MAX:7.0 W×7.0D×1.0T mm MIN:2.5 W×2.5D×0.1Tmm (Option:20.0W×20.0D mm) | |
适用基板 | MAX:180W×120D×3.0Tmm MIN:50W×50D×0.3Tmm (Option:8inch wefer substrate) | MAX:170W×105D×3.0Tmm MIN:50W×50D×0.3Tmm | MAX:180W×120D×3.0Tmm MIN:50W×50D×0.3Tmm (Option:12inch wefer substrate) |
节拍时间 | 0.78sec/Chip(含0.2秒处理时间) (Including 0.2sec process time) | 0.59sec/Chip(含0.16秒处理时间) (Including 0.16sec process time) | 1.35sec/Chip(含0.4秒处理时间) (Including 0.4sec process time) |
安装精度 | ±7μm/3σ (Option:±5μm,±3μm) | ±5μm/3σ (Option:±3μm) | |
最大负载 | 25N(选项/Option:50N , 100N ,200N ,500N) | ||
晶片供给形态 | 5,6,8,12英寸Wafer等/5",6",8",12"wafew-ring (option:12 wafew-ring ) | 5,6英寸Wafer等/5",6"wafew-ring | 8,12英寸Wafer等/8",12"wafew-ring |
自动上料收纳盒 /Automatic magazine Loader | 自动上料收纳盒 /Automatic magazine Loader | 自动上料收纳盒 /Automatic magazine Loader | |
机器尺寸 | 1,200W×1,504D×1,650H mm | 980W×1,040D×1,860H mm | 1,980W×1,620D×1,566H mm |
机器重量 | 约1,800 kg | 约1,500 kg | 约2,100 kg |
标准搭载功能 | 预热工作台(加温)/ Preheating table(Warming) 安装工作台(加温)/ Mounting table(Warming) 吸嘴自动清洁 / Automated mounting nozzle cleaning US管理 / Ultrasonic power monitoring 晶片高度测量 / Chip height measuring 凸点检测 / Bump detection NG标记检测 / Detection of NG marking Waferθ校正 / Adjustment for wafer rotational position wafer扩展 / Wafer seet expander 热吹/ Hot air blower 吸嘴背面监视 / Monitorring of mounting nozzle tip condition 对应区域网 / LAN connection interface 吸嘴使用次数计数器 / frequency counter of use of mounting nozzle 管理生产信息 / Production data logging | ||
选项及特殊功能 | 上料、卸料用收纳盒 / Magazine , Loader and Unloader 除电鼓风机 / Neutralized air blower HEPA过滤器 / HEPA filter 挡案监视器 / Mounting profile monitetor 对应晶片托盘 / Compatible with chip supply tray 地图数据 / Map data 吸嘴加热 / Mounting nozzle heater 基板(集成块)特殊抑制/ submount (or package) holder 安装检查 / OK/NG judgment 安装研磨喷嘴夹具 / Nozzle polishing Jig |
※ 因改善、改良,规格、外观可能在无事先通知的情况下进行变更。
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