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TCB Flip Chip Bonder for C2S and C2W
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Price:
price negotiable
Brand Name:
SHINKAWA LTD.Country Region:
JapanModel No:
FPB-1ws NeoForce
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SHINKAWA LTD. 
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Country: Japan
Main Products: Wire Bonder、Die Bonder
View more
Price:
price negotiable
Brand Name:
SHINKAWA LTD.Country Region:
JapanModel No:
FPB-1ws NeoForce
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SHINKAWA LTD. 
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Japan
Main Products:
Wire Bonder、Die Bonder
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Product information
- 对应Chip to Wafer TCB工艺的灵活封装贴片机
- 可通过短时间切换,对应Chip to Substrate 的TCB工艺
- 可对应Face down工艺(Face up工艺为选配)
- 可对应TCB(NCP/NCF/TC-CUF)、C2、C4、FO-WLP等工艺
- 通过独自的NVS (Non Vibration System) 技术,实现高精度贴片
- 通过FFG[Force Free Gantry],可对应高达350N的高荷重
- 使用高速脉冲温控系统,可以在短时间内进行加热/冷却,实现高产出
- 具有工艺监控及管理功能,实现品质稳定及工艺便携性
- 可对应各种吸取方式,可搬送薄芯片
- 通过产品品种自动切换功能,具备可进行4种不同芯片的贴片功能,可对应2.5D、3D叠层
- 通过Multi Head功能,实现高产出/小型化
- 灵活支持各种选项
1. Face up工艺
2. 大型芯片(□35mm)的TCB安装
3. 将FLUX材料转录供应给芯片的功能
4. 从带盘供给芯片
5. 通过OHT供给Base Wafer
基本规格
项目 | 内容 | |
---|---|---|
品名 | 灵活封装贴片机 | |
型号 | FPB-1ws NeoForce | |
贴片工艺 | TCB工艺(NCP/NCF/TC-CUF),C2/C4工艺,FO-WLP工艺 | |
贴片精度 | ±2.5μm (3σ) 根据本公司实装条件 | |
UPH | UPH 6,000 (C4 mode/不包含工艺时间) 根据本公司实装条件 | |
贴片荷重 | 0.3~350N ※根据Bonding条件可选择荷重的控制方式 但是,同一个焊接程序内,高荷重控制和低荷重控制不可切换。 ・低荷重控制方式:0.3~20N ・高荷重控制方式:10~350N | |
贴片工具温度设定 | 室温~400℃ (1℃/Step、脉冲加热) | |
贴片台温度设定 | 室温~200℃ (1℃/step) | |
芯片尺寸 | □1~22mm、t=0.02~0.7mm(□22mm以上 : 选购件 / 具体内容另行协商) | |
晶圆尺寸 | φ200mm,φ300mm | |
基础晶圆尺寸 | φ300mm (φ200mm 可选)/ 基板 | |
贴片方向 | Face down (Face up:选购件:条件需要商量) | |
选购件 | 通信接口 SECS II,HSMS,GEM | |
驱动源 | 输入电源 | 单相 AC 200~240V±5% 50/60Hz(如电压不同,需商量) |
消费电力 | 最大 14.0kW | |
空气 | 570kPa (5.7kgf/cm2) ,300L/min,接口:φ10 Tube 3处 | |
真空 | -75kPa (-550mmHg)以下 (测量压),接口:φ10 Tube 3处 | |
机器尺寸重量 | 约2,520W x 1,620D x 1,750H mm 约3,100kg (不包含显示器、信号灯) |
※ 为了改善机器的性能,外观和规格有部分变更的可能,请谅解。
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