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High-Speed&High-Accuracy Die Bonder for small chip
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Price:
price negotiable
Brand Name:
SHINKAWA LTD.Country Region:
JapanModel No:
STC-800
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SHINKAWA LTD. 
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Country: Japan
Main Products: Wire Bonder、Die Bonder
View more
Price:
price negotiable
Brand Name:
SHINKAWA LTD.Country Region:
JapanModel No:
STC-800

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SHINKAWA LTD. 
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Japan
Main Products:
Wire Bonder、Die Bonder

Product information
- 贴片精度为±20μm(3σ)(选配可对应±15um(3σ))
- 与以往机型相比UPH提高10%
- 采用线性驱动,提高了框架的搬送精度
- 可对应宽达86mm的引线框,可对应Y焊接区域76mm(热共晶方式)
- 功能更加丰富,可灵活应对各种元器件 (晶圆蓝膜拉伸量可变参数、芯片识别用相机对焦功能等)
- 采用银浆组件,可对应银浆焊接(双机头)
- 搭载了Universal Feeder,可对应最大宽100mm、最大长300mm的引线框(点胶方式)
- 通过使用芯片背面识别相机(选购件),实现更高的精度、更多样的检查功能
- 可提供共晶、WBC/DAF*、银浆工艺等工艺转换的套件
* WBC/DAF : Wafer Backside Coating / Die Attach Film
基本规格
项目 | 内容 | |
---|---|---|
品名 | 贴片机 | |
型号 | STC-800 | |
贴片工艺 | 热共晶方式、点胶方式、热压着方式 | |
贴片精度 | 标准 XY :±20μm (3σ),θ :±3°(3σ) 依据本公司贴片条件测定 高精度 XY :±15μm (3σ),θ :±3°(3σ) 依据本公司贴片条件测定 | |
机器周转时间 | 0.140s/芯片(Y=40mm时) 依据本公司贴片条件测得平均时间 0.168s/芯片 UPH 21,400 | |
引线框送料器设定温度 | 固定送料器 :室温 ~ 500℃(3ch控制) 通用式送料器:室温(Option:室温~200℃) | |
引线框运送 | 固定送料器、针运送(热共晶方式、热压着方式) 通用式送料器、抓料运送(点胶方式、热压着方式) | |
晶圆拉伸量 | 5~15mm(可变) | |
芯片尺寸 | □0.12~1.5mm(热共晶方式、热压着方式) □0.3~3.0mm(点胶方式、热压着方式) | |
晶圆尺寸 | 最大 8英寸 | |
引线框尺寸 | 宽度 | 20 ~ 86mm(最大贴片区域=76mm)热共晶式 30 ~ 100mm(最大贴片区域=90mm)点胶法、热压着法 |
长度 | 长度 | |
厚度 | 厚度 | |
选购件 | 料盒抓取方式、芯片背面识别功能 | |
驱动源 | 输入电源 | 单相 AC 200V±5% 50/60Hz(如电压不同,请咨询本公司营业人员) |
功耗 | 最大 2.23kVA(2.0kW)热共晶式 最大0.93kVA(0.78kW)点胶法 | |
空气 | 400kPa (4kgf/cm2) ,250L/min 连接:φ8 Tube 2处 | |
氮气 | 200kPa (2kgf/cm2) ,10L/min 连接:φ6 Tube 1处 | |
混合气体 | N295%+ H25%(仅限于热共晶式时) | |
真空 | -87kPa (-650mmHg)以下 (测量压) 连接:φ8、Tube 1处 | |
机器尺寸重量 | 约 1,115W × 1,130D × 2,110H mm 约 1,160kg (不包含显示器,信号灯) |
※ 为了改善机器的性能,外观和规格有部分变更的可能,请谅解。
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