








Product information
1.EFEM(Semiconductor device Front End module) is mainly used for automatic loading and unloading of wafers. The product features are: high cleanliness, high safety, high precision, anti-static, anti-corrosion, nitrogen cleaning, etc.
EFEM parameters:
1/2/3/4 Loadports or smifPods
Suitable for 150mm-300mm wafers
Wafer thickness 300~1000um, Warpage≤1mm
SCR two-arm robot
Ultra-thin vacuum arm or Bernoulli arm or edge grip arm
Vacuum or edge clamp Aligner
OCR (IOSS), high-definition read WaferID
Configure the E84 module to support the lifting and discharging of materials
RFID reading
EFU & Ionizer
EAP interconnection to achieve data
2.Sorter(Wafer Winder) is a process device used in the semiconductor manufacturing industry.
Sorter parameter:
2/3/4 LoadPort design
Compatible with 200mm-300mm wafers
Wafer thickness 300~1000um, Warpage≤1mm
Automatic identification of FOUP or Cassette
The GTCR robot
WPH up to 230 tablets
Ceramic ultra-thin vacuum or Bernoulli gripper (customizable)
Vacuum Aligner
OCR (IOSS), high-definition read WaferID
Configure the E84 module to support the lifting and discharging of materials
RFID reading
EFU & Ionizer
The wafer can be split arbitrarily
Support SECS/GEM factory communications











