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Global Trading Service Platform for Machinery

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+86 25-84532303
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sunyuchen@sumec.com.cn
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room temperature, full-wafer 2D/3D stress mapping systems
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FSM
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FSM
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U.S.A
Main Products:
Chip thickness and through hole depth measurement tool
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Product information

FSM 128系列系统是室温、全晶圆2D/3D应力映射系统。128个系统使用FSM的专利非接触式Opti-Lever双激光自动开关技术,该技术具有微定位探测器,可以在从小到大弓或应力的大动态范围内高精度测量激光束偏转。FSM的应力计能够在秒内扫描每英寸1000个点,对未加工和有图案的晶圆片进行高分辨率、高精度的应力映射。

128L C2C

专用薄膜应力映射系统具有高分辨率的高通量过程控制。全自动盒式到盒式,SECS/GEM兼容300mm薄膜应力和弯曲测量工具。双FOUP或单FOUP配置可用。集成晶圆衬底厚度测量可用。

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room temperature, full-wafer 2D/3D stress mapping systemsAll products in the store