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room temperature, full-wafer 2D/3D stress mapping systems

Price:
price negotiable
Brand Name:
FSMCountry Region:
U.S.AModel No:
128L C2C


FSM 

Country: U.S.A
Main Products: Chip thickness and through hole depth measurement tool
View more
Price:
price negotiable
Brand Name:
FSMCountry Region:
U.S.AModel No:
128L C2C


FSM 

U.S.A
Main Products:
Chip thickness and through hole depth measurement tool

Product information
FSM 128系列系统是室温、全晶圆2D/3D应力映射系统。128个系统使用FSM的专利非接触式Opti-Lever双激光自动开关技术,该技术具有微定位探测器,可以在从小到大弓或应力的大动态范围内高精度测量激光束偏转。FSM的应力计能够在秒内扫描每英寸1000个点,对未加工和有图案的晶圆片进行高分辨率、高精度的应力映射。
128L C2C
专用薄膜应力映射系统具有高分辨率的高通量过程控制。全自动盒式到盒式,SECS/GEM兼容300mm薄膜应力和弯曲测量工具。双FOUP或单FOUP配置可用。集成晶圆衬底厚度测量可用。
All products in the store
room temperature, full-wafer 2D/3D stress mapping systems


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