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sunyuchen@sumec.com.cn
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Laser Grooving Machine
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海杰兴
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海杰兴
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China
Main Products:
Laser cutting of wafer
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Product information

Fully automatic laser slotting machine is used in the previous process of mechanical cutting wafer, through the high energy laser cutting wafer surface cut Low-K, Gan and other materials and TEG removal, the wafer substrate is exposed to improve the quality and efficiency of mechanical cutting.

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