SUMEC TOUCH WORLD

The fully automatic laser grooving machine independently developed by Haijiexing Technology covers nanosecond and picosecond dual series and is suitable for precision processing of wafers of various special materials, including:

1. Grooving of Low-K material, gallium nitride (GaN), and silicon carbide (SiC) wafers

2. Full cutting of thick-backed gold circles

3. Full cutting of ultra-thin wafers

Nanosecond series-known for its high efficiency and meeting mass production needs;

Picosecond series-wins with high precision and low heat impact to ensure processing quality.

In addition, the equipment supports back cutting and step skipping cutting functions to adapt to complex process scenarios and improve production flexibility and yield.

Suzhou Haijiexin Technology Co. , Ltd. was founded in the 2021, is located in Suzhou high-tech zone, specializing in laser diode wafer cutting field, is a research and development, manufacturing, sales in one of the professional semiconductor equipment company.

Located in Suzhou hi-tech Zone, Suzhou Haijiexin Technology Co. , Ltd. specializes in the field of laser diode wafer cutting, and is a professional semiconductor equipment company integrating R & D, manufacturing and sales. The company is equipped with a thousand-class clean room, high-precision 3D optical microscope and other instruments and supporting equipment to facilitate customer false film or formal wafer verification.