







Product information
Mrs-t260 is a full-automatic double-spindle wafer dicing machine. It can be widely used in wafer saw of all kinds of wafers, ceramics, silicon, glass and lithium niobate. At the same time compatible with QFN, DFN, PCB pakge saw processing scenes, with high-definition image accurate positioning, automatic tool mark detection, BBD knife damage detection, NCS non-contact height measurement, cleaning and UV functions. Main configuration (see product manual for details)• Mainstream 8-inch & 12-inch ceramic disc, compatible with wafer cutting 8/12” and below; • high power dual spindle, multiple cutting modes; • Image Recognition Function, automatic positioning; • BBD (knife breakage detection) function; • NCS (non-touch height detection) function; • Knife Mark Detection Function, multi-workpiece cutting selection system; • Cleaning function • Optional UV function/automatic knife sharpening function; Main parameters of MRS-T260 magnesium-gamma biaxial dicing machine








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