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Third-Generation Semiconductor Non-Visual Particle Detection Equipment (ZPC)

Particle inspection equipment in wafer manufacturing is used to detect tiny particles or impurities on the surface or inside the wafer. These particles or impurities may adversely affect the quality and performance of the wafer, such as causing circuit shorts, failures, or reducing chip reliability. Therefore, the role of particle detection equipment is to ensure the cleanliness and quality of wafers during the manufacturing process, thereby improving the success rate of chip manufacturing and product reliability.

The ZPC equipment can quickly and accurately detect tiny particles on the surface of wafers and provide detailed analysis reports, helping manufacturers quickly identify and address potential quality issues. It measures parameters such as the size, shape, and thickness of the wafer to ensure compliance with specifications and provide reference data for subsequent processes.

Key Features and Advantages:

Comprehensive Detection: Capable of detecting all known defects on wafers, ensuring product quality and production efficiency.
Universal Applicability: Suitable for EPI and Substrate, as well as transparent and non-transparent materials, meeting the requirements of different processes and materials.
High Precision: Detects defects as small as 80nm, providing high-precision defect detection capability.
High-Speed Detection: Detection speed is significantly faster than competitors, improving production efficiency and process benefits.
DIC Technology: Utilizes DIC technology with high detection sensitivity, greatly increasing the Defect Capture Rate, enhancing detection reliability and accuracy.
Low-Noise Light Source: Equipped with a low-noise light source to ensure stability and reliability of data acquisition.
High Resolution: Utilizes a high-resolution detector, providing clear images and data for defect analysis and identification.
Advanced AI Algorithms: Equipped with advanced AI algorithms to improve data processing and analysis efficiency, accelerating the defect detection process.
Wide Wavelength Coverage: Uses 310-320nm excitation laser and detector segmentally covers fluorescence bands from 370nm to 1000nm, achieving the most comprehensive fluorescence detection.

With its comprehensive, universal, high-precision, high-speed, and advanced technological advantages, this product has become the leading choice for non-visual particle detection in the semiconductor field, providing users with reliable quality assurance and productivity enhancement.

ZAS Semiconductor is a company established in 2020, headquartered in Jiangbei New District, Nanjing City. The company is dedicated to driving the development of the semiconductor inspection-related industry chain, including precision instruments, precision machinery, optical module processing, deep ultraviolet optical component processing, high-resolution cameras, and more.

Company establishment (2020.03) : ZAS Semiconductor was established in March 2020, headquartered in Jiangbei New District, Nanjing.
In October 2020, the geometric topography measurement equipment completed the 200mm principle verification machine.
In May 2021, the graphic geometry measurement equipment completed the 200mm/300mm transition model.
In June 2021, the 200mm prototype of the geometric topography measurement equipment was completed.
In August 2021, a 300mm prototype was completed by the geometric shape measurement equipment.
Product market expansion (2021.11-2022.12) :
In November 2021, the PCG project was launched to start the research and development of particle detection equipment.
In December 2021, the first domestic graphic geometry measurement equipment was shipped and entered the Fab client.
In April 2022, the non-graphic geometry measurement equipment obtained the first domestic silicon wafer factory order.
In July 2022, the graphics geometry measurement equipment completed the first full-wafer with graphics in China.
In September 2022, the geometric topography measurement equipment was delivered to the first domestic silicon wafer factory without graphic geometry.
In December 2022, the graphic geometry measurement equipment obtained batch orders from customers.
Product Innovation (2023.12) :
In December 2023, the prototype of particle detection equipment will be completed to further enhance the product line."

ZAS Semiconductor is a company established in 2020, headquartered in Jiangbei New District, Nanjing City. The company is dedicated to driving the development of the semiconductor inspection-related industry chain, including precision instruments, precision machinery, optical module processing, deep ultraviolet optical component processing, high-resolution cameras, and more.The core technology of the company is advanced patented technology in the field of measurement, as well as an autonomous and controllable supply chain system.

Since the establishment of the company, ZAS Semiconductor has continuously innovated, rapidly introduced a series of geometric shape measurement equipment and particle detection equipment, and made a series of important progress. The company's geometry measurement equipment plays a key role in the wafer manufacturing process, providing key parameters such as stress, warpage and flatness. Compared with traditional products, ZAS Semiconductor‘s equipment has the advantages of high precision, rapid testing and high data density, which is highly recognized by customers and supported by batch orders.

At the same time, ZAS Semiconductor also focuses on the development of non-graphic wafer particle detection equipment, which can quickly detect particles, scratches and other defects on the wafer surface, meeting the needs of mature processes and high-level needs.

With advanced technology and excellent products, ZAS Semiconductor has won investment and support from domestic and foreign investment institutions and industry capital, providing strong support for the company's research and development and production and operation."

ZAS Semiconductor Equipment Co., Ltd. was established in March 2020, with its headquarters located in Jiangbei New District, Nanjing

ZAS provide Semiconductor Industry focusing wafer geometry and inspection tool,including

I.wafer geometry(Bow/Warp/Stress,etc.);

2.un-patterned wafer particle inspection;

3.Thin-Film thickness measurement(Metal,dielectric);

4.Overlay measurement;

5.pattern wafer darkfield

The company's main production and research sites are currently located in Nanjing, Jiangsu Province, with approximately 1200 square meters of cleanrooms operating at Class 1000/Class 100 standards, and over 5000 square meters of space allocated for warehousing, research labs, and office facilities. In 2024, there are plans to add three additional production and research sites: one approximately 1200 square meters in Nanjing, Jiangsu Province; another approximately 2000 square meters in Changchun, Jilin Province; and a third in Beijing, with over 6000 square meters designated for production, research, and office space.

With its international patents and advanced technology in the field of measurement and detection, Zhong'an Semiconductor demonstrates strong trading capabilities. The company has successfully introduced the WGT series of equipment, achieving significant market performance and garnering repeated recognition and bulk orders from clients. Concurrently, it continuously enhances close collaborations with clients, suppliers, and partners, committed to delivering high-quality products and services. Leveraging its comprehensive strengths in technological innovation, manufacturing, and marketing, Zhong'an Semiconductor has become a trusted partner in the industry, providing clients with comprehensive solutions and support.