SUMEC TOUCH WORLD

Wafer Surface Warpage and Stress Measurement Equipment (WGT-V)

Wafer geometry measurement equipment plays a crucial role in wafer manufacturing, not only in measuring the geometric parameters of wafers but also in ensuring the quality and reliability of the entire manufacturing process. Firstly, wafer manufacturing is a highly precise process, where even minor geometric deviations can lead to issues in subsequent chip manufacturing, such as circuit connectivity failure or performance degradation. Therefore, by accurately measuring parameters like diameter, thickness, and flatness of wafers, manufacturers can detect potential issues early and correct them promptly to ensure the quality and performance of the final product.

Quality control is particularly important in wafer manufacturing, as wafers serve as the foundational material for chip manufacturing, directly impacting chip performance and reliability. By using wafer geometry measurement equipment, manufacturers can effectively monitor various stages of the manufacturing process, reduce deviations and defects, lower scrap rates, and enhance production efficiency.

Key Features and Advantages:

Wide Application: Suitable for wafer manufacturing, wafer-level packaging, and semiconductor process equipment development and manufacturing fields, meeting the needs of different process production lines.
Dual-Surface Morphology and Thickness Measurement: Utilizes two spectrum confocal displacement sensors arranged in opposition to achieve high-precision measurement of both sides and thickness of wafers.
High-Precision Displacement Measurement: Spectrum confocal technology ensures high-precision displacement measurement, ensuring the accuracy and reliability of measurement results.
Accurate Measurement of Both Sides and Thickness: Opposing sensors provide precise measurements of both sides and thickness, providing comprehensive morphology and thickness information.
Multi-Line Measurement: Setting the line angle allows simultaneous measurement of multiple lines, improving measurement efficiency and data acquisition speed.
High-Density Data Points: The equipment features high-density data points, with a lateral resolution of up to 200μm, providing finer surface morphology and thickness distribution.
Advanced Algorithms: Advanced algorithms can predict the post-polishing NT map, allowing users to understand the wafer surface condition after polishing in advance, providing reference for subsequent processes.
Unaffected by Metal Contamination: The equipment is not affected by metal contamination during measurement and can accurately measure various types of wafers.

With its high precision, efficiency, and customizability, this product has become the ideal choice for wafer manufacturing and semiconductor process fields, providing users with reliable quality assurance and productivity enhancement.

ZAS Semiconductor is a company established in 2020, headquartered in Jiangbei New District, Nanjing City. The company is dedicated to driving the development of the semiconductor inspection-related industry chain, including precision instruments, precision machinery, optical module processing, deep ultraviolet optical component processing, high-resolution cameras, and more.

Company establishment (2020.03) : ZAS Semiconductor was established in March 2020, headquartered in Jiangbei New District, Nanjing.
In October 2020, the geometric topography measurement equipment completed the 200mm principle verification machine.
In May 2021, the graphic geometry measurement equipment completed the 200mm/300mm transition model.
In June 2021, the 200mm prototype of the geometric topography measurement equipment was completed.
In August 2021, a 300mm prototype was completed by the geometric shape measurement equipment.
Product market expansion (2021.11-2022.12) :
In November 2021, the PCG project was launched to start the research and development of particle detection equipment.
In December 2021, the first domestic graphic geometry measurement equipment was shipped and entered the Fab client.
In April 2022, the non-graphic geometry measurement equipment obtained the first domestic silicon wafer factory order.
In July 2022, the graphics geometry measurement equipment completed the first full-wafer with graphics in China.
In September 2022, the geometric topography measurement equipment was delivered to the first domestic silicon wafer factory without graphic geometry.
In December 2022, the graphic geometry measurement equipment obtained batch orders from customers.
Product Innovation (2023.12) :
In December 2023, the prototype of particle detection equipment will be completed to further enhance the product line."

ZAS Semiconductor is a company established in 2020, headquartered in Jiangbei New District, Nanjing City. The company is dedicated to driving the development of the semiconductor inspection-related industry chain, including precision instruments, precision machinery, optical module processing, deep ultraviolet optical component processing, high-resolution cameras, and more.The core technology of the company is advanced patented technology in the field of measurement, as well as an autonomous and controllable supply chain system.

Since the establishment of the company, ZAS Semiconductor has continuously innovated, rapidly introduced a series of geometric shape measurement equipment and particle detection equipment, and made a series of important progress. The company's geometry measurement equipment plays a key role in the wafer manufacturing process, providing key parameters such as stress, warpage and flatness. Compared with traditional products, ZAS Semiconductor‘s equipment has the advantages of high precision, rapid testing and high data density, which is highly recognized by customers and supported by batch orders.

At the same time, ZAS Semiconductor also focuses on the development of non-graphic wafer particle detection equipment, which can quickly detect particles, scratches and other defects on the wafer surface, meeting the needs of mature processes and high-level needs.

With advanced technology and excellent products, ZAS Semiconductor has won investment and support from domestic and foreign investment institutions and industry capital, providing strong support for the company's research and development and production and operation."

ZAS Semiconductor Equipment Co., Ltd. was established in March 2020, with its headquarters located in Jiangbei New District, Nanjing

ZAS provide Semiconductor Industry focusing wafer geometry and inspection tool,including

I.wafer geometry(Bow/Warp/Stress,etc.);

2.un-patterned wafer particle inspection;

3.Thin-Film thickness measurement(Metal,dielectric);

4.Overlay measurement;

5.pattern wafer darkfield

The company's main production and research sites are currently located in Nanjing, Jiangsu Province, with approximately 1200 square meters of cleanrooms operating at Class 1000/Class 100 standards, and over 5000 square meters of space allocated for warehousing, research labs, and office facilities. In 2024, there are plans to add three additional production and research sites: one approximately 1200 square meters in Nanjing, Jiangsu Province; another approximately 2000 square meters in Changchun, Jilin Province; and a third in Beijing, with over 6000 square meters designated for production, research, and office space.

With its international patents and advanced technology in the field of measurement and detection, Zhong'an Semiconductor demonstrates strong trading capabilities. The company has successfully introduced the WGT series of equipment, achieving significant market performance and garnering repeated recognition and bulk orders from clients. Concurrently, it continuously enhances close collaborations with clients, suppliers, and partners, committed to delivering high-quality products and services. Leveraging its comprehensive strengths in technological innovation, manufacturing, and marketing, Zhong'an Semiconductor has become a trusted partner in the industry, providing clients with comprehensive solutions and support.