SUMEC TOUCH WORLD

Fully automatic ball planting system 

MIZAR BA-1700PLUS 

Support single and Strip products

Techsense has a wealth of experience in the production of semiconductor automation equipment, hardware and software all self-developed, modular design, completely independent control of all the details of the equipment, in addition to the provision of standard equipment, but also according to customer requirements for a variety of custom hardware and software. For example, microsphere implantation technology, microsphere replenishment technology, micro-pin implantation technology, pin levelling technology, chip surface defects inspection technology, ultra-low load mounting technology, ultra-high precision mounting technology, dual-field of view lens alignment technology, thermal expansion control technology, ultra-thin chip extraction technology, residual wafer positioning and absorption technology, SECS/GEM communication system, advanced language integration control system, and so on. We have full experience in anti-static treatment of machines and product safety protection. We have developed a variety of models that have reached the advanced level in the industry.

Techsense has a wealth of experience in the production of semiconductor automation equipment, hardware and software all self-developed, modular design, completely independent control of all the details of the equipment, in addition to the provision of standard equipment, but also according to customer requirements for a variety of custom hardware and software. For example, microsphere implantation technology, microsphere replenishment technology, micro-pin implantation technology, pin levelling technology, chip surface defects inspection technology, ultra-low load mounting technology, ultra-high precision mounting technology, dual-field of view lens alignment technology, thermal expansion control technology, ultra-thin chip extraction technology, residual wafer positioning and absorption technology, SECS/GEM communication system, advanced language integration control system, and so on. We have full experience in anti-static treatment of machines and product safety protection. We have developed a variety of models that have reached the advanced level in the industry.

Shanghai Shiyu Precision Equipment Co.

Located in Songjiang District, Shanghai, the company is a high-tech enterprise specialising in the development and manufacture of semiconductor automation equipment. The company's main products include ball placement equipment, chip appearance inspection and sorting machines, precision chip mounting machines, laser marking machines, substrate transfer equipment, AGV+Robot automation systems, and customised automation systems. The company is based on independent research and development, to provide domestic and foreign customers with high-quality products, to help the development of the semiconductor industry.

As a high-tech enterprise, the company has hundreds of technical R&D team, has obtained more than 100 patents, the main customers are well-known semiconductor manufacturers.

Shanghai Shiyu Precision Equipment Co.

Located in Songjiang District, Shanghai, the company is a high-tech enterprise specialising in the development and manufacture of semiconductor automation equipment. The company's main products include ball placement equipment, chip appearance inspection and sorting machines, precision chip mounting machines, laser marking machines, substrate transfer equipment, AGV+Robot automation systems, and customised automation systems. The company is based on independent research and development, to provide domestic and foreign customers with high-quality products, to help the development of the semiconductor industry.

As a high-tech enterprise, the company has hundreds of technical R&D team, has obtained more than 100 patents, the main customers are well-known semiconductor manufacturers.

The company specializes in high-precision, combination of multiple processes, and multi-axis motion control, such as microsphere implantation technology, microsphere filling technology, micro pin implantation technology, pin leveling technology, chip surface defect inspection technology, ultra-low load loading technology, ultra-high precision loading technology, lens dual field alignment technology, thermal expansion control technology, ultra-thin chip extraction technology, incomplete wafer positioning and absorption technology, SECS/GEM communication system, high-level language integrated control system, etc. Have sufficient experience in anti-static treatment of machines and product safety protection. A variety of models developed have reached the advanced level in the industry.

Many of the company's design and development personnel have long-term working experience in foreign semiconductor equipment companies, and all control software, vision software and communication software are independently developed and produced. Customer-customized software requirements can also be quickly responded to.