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Fiber Laser High Speed Marking
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Fiber Laser High Speed Marking | BLM

Application

In-line high-speed laser marking
of various discrete devices

Product Features

Structure: One-piece, split, vertical, horizontal, etc., for all testers

High Reliability, long life fiber laser

Max. UPH up to 60K

Offline control mode,good stability

Supporting scanning barcode, hierarchical printing, automatic counting and statistics, authority management, production management system docking, etc.

Technical specification 
Laser power5W/10W/20W/30W
Beam qualityM2<1.05
Marking range70×70mm/50×50mm/35×35mm(optional)
UPH60K
Min. line width0.02mm
Min. character height0.15mm
Repetition accuracy±0.01mm
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store