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Fiber Laser High Speed Marking


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
BLM


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
BLM


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
Fiber Laser High Speed Marking | BLM
Application
In-line high-speed laser marking
of various discrete devices
Product Features
Structure: One-piece, split, vertical, horizontal, etc., for all testers
High Reliability, long life fiber laser
Max. UPH up to 60K
Offline control mode,good stability
Supporting scanning barcode, hierarchical printing, automatic counting and statistics, authority management, production management system docking, etc.
Technical specification | |
Laser power | 5W/10W/20W/30W |
Beam quality | M2<1.05 |
Marking range | 70×70mm/50×50mm/35×35mm(optional) |
UPH | 60K |
Min. line width | 0.02mm |
Min. character height | 0.15mm |
Repetition accuracy | ±0.01mm |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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