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Automatic Laser Deflashing
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Automatic Laser Deflashing | LDF

Application

All kinds of package moulding and pin
deflashing
SOT89/SOT223 a class of high-pressure
water is hard to remove the overflow
Laser deflashing residue on the surface
of heat sink of various power devices

Product Features

Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required

Optical shaping technology, ensuring no damage to tube pins.Improving removal efficiency

Dual quad laser head, front and back side laser deflashing synchronously, Increase production capacity.

Automatic loading and unloading,With intelligent identification, automatic flip and anti-reverse function

Technical specification 
Operating modeTwo-way four-head, synchronous work
Laser power50W/100W×2/4
Undistortion scan area300×150mm2
Laser vaporization depth0.004-0.2mm adjustable
UPH≥7500pcs/hr@SOT89
Max. loading volume at one time300 strips
Repeat accuracy±0.05mm
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store