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+86 25-84532303
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sunyuchen@sumec.com.cn
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Strip Laser Marking
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LasTop Technology
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Post RequirementsPost Requirements
LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Strip Laser Marking | CLM

Application

DIP, SOP, TSSOP, BGA, QFN, DFN, QFP
and other IC strip marking
TO-252 package strip markings
SOT89/SOT223/SOT23 SMD component
strip marking

Product Features

Dual laser head marking

Automatic loading and unloading

Various templates for marking, online monitoring of marking quality

Offline control mode ensures stability and printing quality

Marking dust removal

Technical specification 
Laser power20W/30W
Marking range320×175mm
Undistorted scanning area300×150mm
Min. line width0.03mm
Repetition accuracy±0.05mm
Max. loading capacity at one time400 strips
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store