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Strip Laser Marking


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
CLM


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
CLM


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
Strip Laser Marking | CLM
Application
DIP, SOP, TSSOP, BGA, QFN, DFN, QFP
and other IC strip marking
TO-252 package strip markings
SOT89/SOT223/SOT23 SMD component
strip marking
Product Features
Dual laser head marking
Automatic loading and unloading
Various templates for marking, online monitoring of marking quality
Offline control mode ensures stability and printing quality
Marking dust removal
Technical specification | |
Laser power | 20W/30W |
Marking range | 320×175mm |
Undistorted scanning area | 300×150mm |
Min. line width | 0.03mm |
Repetition accuracy | ±0.05mm |
Max. loading capacity at one time | 400 strips |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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