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IC framework Laser Marking
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

IC framework Laser Marking | CLM

Application

Packaging framework 2D code marking

Product Features

Fully automatic loading and unloading. Automatic reverse prevention  and 2D code detection

Vision recognizes laser printed 2D codes

Automatic generation of Mapping data

SECS-GEM communication networking function. automatically obtain 2D code information and upload information

Technical specification 
Laser TypeFiber laser / green laser
2D code  Minimum size2×2mm
Repeatable positioning accuracy0.05mm
Track width10-120mm adjustable
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store