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IC framework Laser Marking


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
CLM


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
CLM


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
IC framework Laser Marking | CLM
Application
Packaging framework 2D code marking
Product Features
Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection
Vision recognizes laser printed 2D codes
Automatic generation of Mapping data
SECS-GEM communication networking function. automatically obtain 2D code information and upload information
Technical specification | |
Laser Type | Fiber laser / green laser |
2D code Minimum size | 2×2mm |
Repeatable positioning accuracy | 0.05mm |
Track width | 10-120mm adjustable |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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