Name: Wafer Laser Scribing
Brand: LasTop Technology
Price: price negotiable
Availability: InStock

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Wafer Laser Scribing

Price：

price negotiable

Brand Name：

LasTop Technology

Country Region：

China

Model No：

Post Requirements

LasTop Technology icon

Country： China

Main Products： Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Price：

price negotiable

Brand Name：

LasTop Technology

Country Region：

China

Model No：

Post Requirements

LasTop Technology icon

China

Main Products：

Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information

Wafer Laser Scribing / Cutting | LS

Application

TAIKO ring cutting, Si/SiC
wafer cutting, Si/SiC wafer
Back metal cutting

Product Features

Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

Correction technology ensures high precision machining and consistency

Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

Support warpage/TAIKO wafer transfer

Technical specification
Laser wavelength	355nm
Laser output power	15/30W
Processing method	Combined scanning and linear/rotary stage motion
Positioning accuracy	±1μm
Processing accuracy	±5μm
Wafer size	6 inch, 8 inch, 12 inch
Chipping	<10μm

LasTop Technology

China

Brand Introduction

ChengduLasTop Technology Co., Ltd. was established in December 2003 and has been engaged in the semiconductor manufacturing equipment industry for 19 years. It is a national high-tech enterprise dedicated to the research and development, production, sales, and technical services of electronic semiconductor laser special equipment. Its products are widely used in the manufacturing fields of integrated circuits, advanced packaging, MEMS, Power Devices, and others. It enjoys a high reputation in the laser processing field of China's third-generation semiconductor, precision manufacturing, new energy and other industries.

Chengdu LasTop Technology Co., Ltd

Company Introduction

Chengdu LasTop Technology Co., Ltd. was established in 2003 and is a well-known high-tech enterprise in China that integrates the research and development, manufacturing, sales, and service of semiconductor laser equipment. The company is headquartered in the High tech Zone of Chengdu, with Shenzhen and Jiangsu subsidiaries, as well as service offices in Suzhou, Shenzhen, Wuhan, Beijing, Xi'an and other places.

LasTop Technology is committed to the innovative application of advanced laser technology in specialized and segmented fields. The company adheres to the development concept of "product independent innovation, technology independent controllability, and market focused main business", and takes customer needs as the driving force. It has launched more than 30 types of laser application professional equipment in semiconductor wafer manufacturing, packaging testing, precision electronics manufacturing, and other fields, with more than 50 independent intellectual property rights. It has developed into a first-class semiconductor and precision electronic process equipment manufacturing enterprise in China.

LasTop Technology is willing to sincerely cooperate with you and create a better future together.

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