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LOW-K Wafer Laser Grooving
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

LOW-K Wafer Laser Grooving | LG

Application

LOW-K wafer
Laser Grooving and scribing

Product Features

8/12 inch compatible

Ultra-fast UV picro-second laser. Excellent process results

Automatic adjustment of grooving width

Auto-focus, image memorization and  identification, manual/auto mode switching function

Multi-CCD positioning & reinspection function

Technical specification 
Wafer Size8 inch, 12 inch
Wafer thickness70-700μm
Scribe channel width≥40μm
Grooving width30-80μm adjustable
Processing speed300-1000mm/s
Positioning accuracy±2μm
Grooving depth10-20μm
Cutting Depth accuracy±3μm
Grooving accuracy of the whole piece±8μm
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IC framework Laser MarkingAll products in the store
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Fiber Laser High Speed MarkingAll products in the store