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LOW-K Wafer Laser Grooving


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
LG


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
LG


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
LOW-K Wafer Laser Grooving | LG
Application
LOW-K wafer
Laser Grooving and scribing
Product Features
8/12 inch compatible
Ultra-fast UV picro-second laser. Excellent process results
Automatic adjustment of grooving width
Auto-focus, image memorization and identification, manual/auto mode switching function
Multi-CCD positioning & reinspection function
Technical specification | |
Wafer Size | 8 inch, 12 inch |
Wafer thickness | 70-700μm |
Scribe channel width | ≥40μm |
Grooving width | 30-80μm adjustable |
Processing speed | 300-1000mm/s |
Positioning accuracy | ±2μm |
Grooving depth | 10-20μm |
Cutting Depth accuracy | ±3μm |
Grooving accuracy of the whole piece | ±8μm |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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