Name: Laser Debonding
Brand: LasTop Technology
Price: price negotiable
Availability: InStock

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Laser Debonding

Price：

price negotiable

Brand Name：

LasTop Technology

Country Region：

China

Model No：

Post Requirements

LasTop Technology icon

Country： China

Main Products： Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Price：

price negotiable

Brand Name：

LasTop Technology

Country Region：

China

Model No：

Post Requirements

LasTop Technology icon

China

Main Products：

Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information

Laser Debonding | LD

Application

Debonding of temporary bonded
wafer by laser, followed by
separating, and cleaning, for
carrier substrate re-use and
ultra-thin wafer subsequent
processing

Product Features

Laser debonding, stripping and cleaning functions

Square top hat beam, benefits high debonding efficiency and low thermal damage

Real-time monitoring and automatic compensation, ensuring process stability

Providing wavelength- matching bonding adhesive

Technical specification
Laser wavelength	355nm/1340nm
Wafer size	6 inch, 8 inch, 12 inch
Laser power	15/30W@355nm, 100W@1340nm
Focused spot size	X:0.2mm~1.0mm, Y:0.2mm~1.0mm
Laser energy density	0.05-1J/cm2
Typical Laser Scan Time	100 sec@12 inch

LasTop Technology

China

Brand Introduction

ChengduLasTop Technology Co., Ltd. was established in December 2003 and has been engaged in the semiconductor manufacturing equipment industry for 19 years. It is a national high-tech enterprise dedicated to the research and development, production, sales, and technical services of electronic semiconductor laser special equipment. Its products are widely used in the manufacturing fields of integrated circuits, advanced packaging, MEMS, Power Devices, and others. It enjoys a high reputation in the laser processing field of China's third-generation semiconductor, precision manufacturing, new energy and other industries.

Chengdu LasTop Technology Co., Ltd

Company Introduction

Chengdu LasTop Technology Co., Ltd. was established in 2003 and is a well-known high-tech enterprise in China that integrates the research and development, manufacturing, sales, and service of semiconductor laser equipment. The company is headquartered in the High tech Zone of Chengdu, with Shenzhen and Jiangsu subsidiaries, as well as service offices in Suzhou, Shenzhen, Wuhan, Beijing, Xi'an and other places.

LasTop Technology is committed to the innovative application of advanced laser technology in specialized and segmented fields. The company adheres to the development concept of "product independent innovation, technology independent controllability, and market focused main business", and takes customer needs as the driving force. It has launched more than 30 types of laser application professional equipment in semiconductor wafer manufacturing, packaging testing, precision electronics manufacturing, and other fields, with more than 50 independent intellectual property rights. It has developed into a first-class semiconductor and precision electronic process equipment manufacturing enterprise in China.

LasTop Technology is willing to sincerely cooperate with you and create a better future together.

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