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Wafer Laser Marking


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
WLM


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
WLM


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
Wafer Laser Marking | WLM
Application
Si wafer, Bonded wafer, SiC/Saphire
wafer laser marking
Product Features
High precision laser processing&depth control
Auto sample transfer, high precision positioning
Auto detection of marking effects
Multi-dust processing,Max. control of particle size
Technical specification | |
Laser wavelength | 355/532nm |
Laser power | 10W/15W@355nm, 15W/30W@532nm |
Wafer Positioning Accuracy | ±0.1mm |
Marking repeatability | ±20μm |
Single point diameter | 45-80μm |
roundness | >95% |
Wafer size | 6 inch, 8 inch, 12 inch |
Font | Standard SIMI font |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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