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sunyuchen@sumec.com.cn
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Wafer Laser Marking
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Wafer Laser Marking | WLM

Application

Si wafer, Bonded wafer, SiC/Saphire
wafer laser marking

Product Features

High precision laser processing&depth control

Auto sample transfer, high precision positioning

Auto detection of marking effects

Multi-dust processing,Max. control of particle size

Technical specification 
Laser wavelength355/532nm
Laser power10W/15W@355nm, 15W/30W@532nm
Wafer Positioning Accuracy±0.1mm
Marking repeatability±20μm
Single point diameter45-80μm
roundness>95%
Wafer size6 inch, 8 inch, 12 inch
FontStandard SIMI font
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