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Ultra-shallow dopant laser annealing
Price：
price negotiable
Brand Name：
LasTop TechnologyCountry Region：
ChinaModel No：
LA
Post Requirements
LasTop Technology 
Country： China
Main Products： Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Price：
price negotiable
Brand Name：
LasTop TechnologyCountry Region：
ChinaModel No：
LA
Post RequirementsLasTop Technology 
China
Main Products：
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
Product information
Ultra-shallow dopant laser annealing | LA
Application
Ultra-shallow dopant laser
annealing for BSI-CCD wafer
Product Features
The first in China, 8 inch mass production equipment
Precise energy density control
UV laser with low penetration depth
1D top hat beam with large lengh/width ratio
Low dopant diffusion
| Technical specification | |
| Wafer Size | 6 inch, 8 inch |
| Junction depth | ≤50nm |
| Impurity peak diffusion depth | ≤5nm |
| RS non-uniformity | ＜2% (WIW/WTW) |
All products in the store
Strip Laser Marking
IC framework Laser Marking
Laser Debonding
Wafer Laser Marking
Laser Decapping
Fiber Laser High Speed Marking
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