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Ultra-shallow dopant laser annealing
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Ultra-shallow dopant laser annealing | LA

Application

Ultra-shallow dopant laser
annealing for BSI-CCD wafer

Product Features

The first in China, 8 inch mass production equipment

Precise energy density control

UV laser with low penetration depth

1D top hat beam with large lengh/width ratio

Low dopant diffusion

Technical specification 
Wafer Size6 inch, 8 inch
Junction depth≤50nm
Impurity peak diffusion depth≤5nm
RS non-uniformity<2% (WIW/WTW)
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