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Laser Induced Crystallization
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

Laser Induced Crystallization | LIC

Application

Laser crystallization of
amorphous materials and
in-situ dopant activation

Product Features

The world's first, 12 inch mass production facility

Independly developped optical system with LIET technology enables high uniformity

Energy density accuracy down to 5mJ/cm2

nS level pulse width control

Technical specification 
Laser wavelength527nm
Wafer size12 inch
Energy modulation accuracy5mJ/cm2
uniformity of beam top≤1%
Focal depth range5mm
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store