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SiC Laser Annealing


Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
LA


LasTop Technology 

Country: China
Main Products: Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price:
price negotiable
Brand Name:
LasTop TechnologyCountry Region:
ChinaModel No:
LA


LasTop Technology 

China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection

Product information
SiC Laser Annealing | LA
Application
SiC wafer Ohmic contact annealling
Product Features
First domestic green laser machine for mass pruduction
High reliability and stability
Independly developped Optical system, LIET technology with IP
Green/UV laser two wavelengths are optional
Technical specification | ||
Wafer Size | 6 inch,8 inch | |
Spot size | X:100~500μm | Y:100~500μm |
Max. laser energy density | Green:10J/cm2 | UV:6J/cm2 |
Specific contact resistance | ~10-5Ω·cm2 | |
Oxygen control | ≤10ppm |
All products in the store
Strip Laser Marking

IC framework Laser Marking

Laser Debonding

Wafer Laser Marking 

Laser Decapping

Fiber Laser High Speed Marking


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