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SiC Laser Annealing
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

SiC Laser Annealing | LA

Application

SiC wafer Ohmic contact annealling

Product Features

First domestic green laser machine for mass pruduction

High reliability and stability

Independly developped Optical system, LIET technology with IP

Green/UV laser two wavelengths are optional

Technical specification  
Wafer Size6 inch,8 inch
Spot sizeX:100~500μmY:100~500μm
Max. laser energy densityGreen:10J/cm2UV:6J/cm2
Specific contact resistance~10-5Ω·cm2
Oxygen control≤10ppm
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store