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SiC Laser Annealing
Price：
price negotiable
Brand Name：
LasTop TechnologyCountry Region：
ChinaModel No：
LA
Post Requirements
LasTop Technology 
Country： China
Main Products： Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
View more
Price：
price negotiable
Brand Name：
LasTop TechnologyCountry Region：
ChinaModel No：
LA
Post RequirementsLasTop Technology 
China
Main Products：
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
Product information
SiC Laser Annealing | LA
Application
SiC wafer Ohmic contact annealling
Product Features
First domestic green laser machine for mass pruduction
High reliability and stability
Independly developped Optical system, LIET technology with IP
Green/UV laser two wavelengths are optional
| Technical specification | ||
| Wafer Size | 6 inch,8 inch | |
| Spot size | X:100~500μm | Y:100~500μm |
| Max. laser energy density | Green:10J/cm2 | UV:6J/cm2 |
| Specific contact resistance | ~10-5Ω·cm2 | |
| Oxygen control | ≤10ppm | |
All products in the store
Strip Laser Marking
IC framework Laser Marking
Laser Debonding
Wafer Laser Marking
Laser Decapping
Fiber Laser High Speed Marking
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