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IGBT Laser Annealing
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LasTop Technology
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LasTop Technology
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China
Main Products:
Wafer laser annealing, wafer laser marking, wafer laser debonding, wafer laser slotting, wafer laser slicing, wafer level laser marking, fully automatic laser glue removal, IC fully automatic laser marking, frame laser marking, and three light spot inspection
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Product information

IGBT Laser Annealing | LA

Application

Ion-activation for silicon IGBT

Product Features

High reliability and stability

Independly developped Optical system

Excellent thermal budget control

50μm ultra-thin TaiKo wafer handling capability

Technical specification    
Wafer size6 inch, 8 inch, 12 inch
Laser power60W*290W*260W*2+300W90W*2+300W
Laser energy density≥5J/cm2×2
Activation efficiency≥95%@B+≥90%@P+
RS non-uniformityWIW:≤1%@3sigmaWTW:≤1%@3sigma
All products in the store
Strip Laser MarkingAll products in the store
IC framework Laser MarkingAll products in the store
Laser DebondingAll products in the store
Wafer Laser Marking All products in the store
Laser DecappingAll products in the store
Fiber Laser High Speed MarkingAll products in the store