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3D Fully Automatic In-Line Solder Paste Printing and Inspection Machine
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China
Main Products:
2D AOI inspection equipment, 3D AOI inspection equipment, 3D SPI solder paste inspection equipment, JUKI shaped insertion machine, SMT complete line solution
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Product information

Product Parameter

ModelMirageMirage-DMirage-LMirage-XLMirage-1500
Lighting SystemsRGB+White LED Ring Light Source
3D bidirectional digital projection
Imaging System5M/12M Industrial High Speed Camera
Resolution

5M:10μm-15μm(tunable) 

12M:  8μm-10μm(tunable),15μm(selectable)

FOV Dimension37.4*30mm (5M,15μm)                40.9*30.7mm (12M,10μm)
Height MeasurementMeasurement of parts up to 8 mm in height
Height Measurement Accuracy1μm
Machine Weight950kg1090kg1090kg1150kg1290kg
Machine size(mm)W1080×D1300×H1850W1160×D1470xH1875W1160×D1470xH1875W1300×D1470xH1875W1300×D1440xH1815
  

W1645xD1470xH1875 

(Add 230 extension rails on both sides)

W1720xD1470xH1875 

(Add 210 extension rails on both sides)

W2310xD1440xH1815

(Add 505 extension rails on both sides)

Substrate size(mm)50*70~510*460monorails:50*70~510*590single segment:50*70~540*610single segment:50*70~680*610single segment:50*70~800*610
dual-track (system):50*70~510*330segmentation:50*70~850*610segmentation:50*70~990*610segmentation:50*70~1100*610
 Extension rails on both sides:50*70-1000*610Extension rails on both sides:50*70-1200*610Extension rails on both sides:50*70-1500*610
Substrate Thickness0.6~6mm0.6~6mm0.6~6mm0.6~6mm0.6~10mm
Inspection Principle2D imaging data analysis + 3D imaging data analysis
Inspection speed350ms/FOV(2D+3D)
Defect detectionLess tin, more tin, continuous tin, offset, leakage, short circuit, pull tip, bad shape, etc.
Substrate transport systemubstrate fixing: Bottom-up fixing, automatic plate entry/exit and automatic width adjustment system, complying with SMEMA standard.
Track height: 900±20mm
Power supply specificationsAC 220V 50/60Hz 1.9KVA
Air Pressure Specifications0.5MPa
Environmental RequirementsTemperature: 5-40°C, relative humidity: 25%-80% frost-free
Link PortStandard SMEMA interface

Product Presentation

3D Fully Automatic In-Line Solder Paste Printing Inspection Machine
Along with the increasing precision of electronic products, SMD components are becoming more and more miniature, the quality of solder paste printing is becoming more and more important. JUTZE SPI can effectively ensure good quality of solder paste printing, improve the printing quality, significantly reduce the possible existence of finished product defects, and effectively save the manpower and time cost of human error correction to improve the production efficiency and capacity.
Mirage adopts the most advanced dual projection technology, walk-stop dynamic image taking, all-round shadow-free testing, intelligent optimisation of the detection path, with high precision, fast detection, stable testing, easy operation and so on.
1、Double light source digital shadow-finding detection without shadow, high precision.
2、Intelligent optimisation of the testing route with high testing efficiency.
3, 3D image display of the whole board, 100% defect coverage.

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