SUMEC TOUCH WORLD

Specially developed for high aspect ratio, ATE board characteristics 

Descriptions 

Specially developed and designed for ultra-high aspect ratio characteristic boards, using the vacuum principle to realise the conductive and non-conductive resin ink hole plugging process, suitable for the whole board plugging process of multiple types of holes on the same board surface, and can be applied to resins, silver paste, copper paste and conductive adhesives and other materials. 

Features 

Can be produce the high aspect ratio panels( 70: 1 ) .

High vacuum up to ≤100pa.  

Flexibility to realise: through holes, blind holes on one or both sides, back drilled holes, etc. on the same board surface. 

Ideal for small quantities and a wide range of gauges, no fixtures or air guides are required for hole plugging. 

The operating interface is automated, user-friendly and easy to operate .

Established in 2002, Shenzhen Shenyitong Electronics Co., Ltd. is a high-tech enterprise integrating R&D, production and sales of PCB, FPC and IC board equipment and materials. Adhering to the "integrity, professionalism, excellence, innovation" business philosophy, with strong scientific research and efficient management, to become one of the most competitive suppliers in the industry.

公司简介成立时间  Established 

深圳市深逸通电子有限公司于2002年成立，是一家集研发、生产、销售PCB、FPC、IC载板设备和材料的高科技企业。秉持“诚信、专业、卓越、创新”的经营理念，藉着强大的科研与高效的管理，成为行业最有竞争力的供应商之一。

Established in 2002, the company is a high-tech enterprise integrating R&D, production and sales of PCB, FPC and IC-Substrate PCB and materials. Adhering to the "integrity, professionalism, excellence, innovation" business philosophy, with strong scientific research and efficient management, to become one of the most competitive suppliers in the industry.     

研发基地  R&D Base 

在华南、华东建立半导体IC载板垂直灌孔&精密研发中心(可量产),与塞孔设备及树脂研发相互验证，进一步全方位服务不同客户及需求。公司设备业务也拓展到了线路板和载板塞孔领域，为客户提供多方面的服务。 Vertical hole filling & precision R&D centre for semiconductor IC-Substrate PCB has been established in South China and East China (mass production is possible), and the research and development of hole plugging equipments and resins are verified with each other, so as to further provide comprehensive services to different customers and needs. The company's equipment business has also expanded to the field of circuit board and carrier board hole plugging, to provide customers with a variety of services.   

核心技术 Core Technology 

超过20年的深耕发展，公司已形成树脂塞孔系列设备制造、树脂油墨研发生产的专业技术，在真空塞孔机领域处于业界领先地位，提供垂直、水平双仓和CCD全自动等全面的设备解决方案。   

With more than 20 years of deep-rooted development, the company has formed expertise in the manufacture of resin plugging series equipment, resin ink R&D and production, and is an industry leader in the field of Vacuum Plugging machines, providing comprehensive equipment solutions such as vertical, horizontal dual-compartment and CCD fully-automatic.   

厂商代理  Agent