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Fully automatic online substrate appearance inspection machine
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China
Main Products:
2D AOI inspection equipment, 3D AOI inspection equipment, 3D SPI solder paste inspection equipment, JUKI shaped insertion machine, SMT complete line solution
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Product information

Product Parameter

modeLegendLegend-DLegend-XLLegend-2000
Substrate specificationsSubstrate size (mm)50×70~510×460

When monorail mode is enabled:50×70~510×590

When dual track mode is enabled:50×70~510×330

Single section:50×70~680×610

Segmentation:50×70~990×610

Extension rails on both sides:50×70~1200×610

Single section:50×70~1000×650

Segmentation:50×70~1200×650

Extension rails on both sides:50×70~2000×650

Substrate height limitation

Above:35mm

Below:50mm

Above:35mm

Below:50mm

Above:35mm

Below:50mm

Above:35mm

Below:50mm

Substrate thickness0.6~6.0mm0.6~6.0mm0.6~10mm0.6~10mm
Track specificationsTrack specifications900±20mm900±20mm900±20mm900±20mm
Track flow directionSet before leaving the factory according to customer requirements
External dimensions(mm)W1000×D1165×H1800W1000×D1530×H1800

W1300×D1470×H1875

W1720×D1470×H1875(add 210 extension rails  on both sides)

W1550×D1475×H1830

W3150×D1475×H1830(add 800 extension rails on both sides)

Equipment weight735kg870kg1150kg1350kg
Sports moduleLinear motor+grating ruler
vision systemImaging systemIndustrial high-speed camera 5M (12M) optional
Telecentric lens (optional)
lightingHigh brightness six channel LED light source
resolving power5μm~15μm
FOV size36.7mm×30.7mm(5M  15μm)
Bending compensation±3mm
Detection principle2D imaging data analysis
Detection speed3-5FOV/sec
Inspection itemsMissing parts, offset, pole reversal, monument, bridge connection, insufficient tin, pin floating, pin bending, OCV, etc
Power specificationsAC 220V 50/60Hz 1.8KVA
Air pressure requirements0.5MPa
Environmental requirementsTemperature: 5-40 ℃, relative humidity: 25% -80%, no frost formation
Communication methodsStandard SMEMA interface

Product Presentation

Fully automatic online substrate appearance inspection machine

1. Collect SPI, AOI before and after the furnace, and the entire process data of the reflux furnace, comprehensively analyze the causes of defects, and achieve complete process control of the production line

2. Real time SPC data analysis and processing

3. Centralized management, one person controlling multiple lines, reducing the number of people online

4. Remote debugging and program updates without stopping online

Product advantages:

New visual system

High speed camera for capturing multiple lighting images within the same FOV

New light source, independently controllable six channel light source3 exposure imaging to eliminate Bayer Pattern blur

With clearer and different lighting angles, the detection performance is significantly improved

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