








Product information
Product highlight process unit layer arrangement
A total of 6 layers within the PSB, PSRT
Each PSRT is responsible for the wafer transfer within one layer of the process unit
Each layer can be configured with up to 4 SPIN process units 12 CP & HP process units according to different user requirements, SPIN units can be configured as coating and developing units, CP & HP units can be configured as baking unit, bottom adhesion unit and WEE, etc. SPIN process units (rotary coating and development) can be configured with up to 24 units and 72 units for CP & HP units
Self-developed core components
High temperature ceramic heating plate, multi-zone heating to achieve the best temperature uniformity control; secondary precision metering pump, to realize the precise quantification of optical resistance.













![[Second-hand] laser](https://cdn.sumecdtx.com/equipment/20230818/928f9346aceb42e3b60670c380399f59.jpg)



