








Product information
Applicable field packaging, MEMS, IGBT, LED
For 6,8 or 12 inch wafers and squares, special shapes
Adapted to the photoresist viscosity <50 cps, positive or negative photoresist
The flow rate is 0.25ml / second for50cps, and the nozzle theoretical flow rate reaches the maximum value at the viscosity of 10 cps
The upper limit of the concentration of major solid particulate matter is 40%
The particle diameter of the main solid state families is 0.1 times the average atomization particle diameter, automatic mechanical arm spraying, automatic rotating baking tray, automatic after baking and handling
Continuous pulsatile continuous supply pump
Manual up and down multiple clips or Robot automatic standard wafer upper and lower chips
The modular unit facilitates maintenance
Graphical human-computer interaction interface













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