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Product information
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● Equipment with over 10,000 high digital channels enables large-scale parallel testing
● Ultra-low power consumption design ensures greater system stability
● Key architecture, system technology, and mechanical design are all developed and manufactured domestically
● System tests over 50 brands, types, and capacities of memory chips (NOR NAND Flash) and logic chips
● Logic testing achieves nearly 100% parallel test efficiency, with single-site and multi-site test times being almost identical. The more sites tested simultaneously, the greater the cost reduction benefits.
● Unique LAES technology significantly reduces site-to-site interference, enhancing multi-site test stability and product yield
● The system is equipped with online calibration functionality, ensuring test accuracy and stability (calibration can be performed online)
● The system supports dynamic burn-in, stress testing, final testing, and wafer testing, with one platform supporting all test types
● Combining expertise with TIS’s Socket/Pin and PCB (Loadboard/Probecard) design capabilities, we provide customers with a one-stop (Turn-Key) service, shortening the time to mass production testing while ensuring test quality
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