SUMEC TOUCH WORLD

The modified high-frequency board PTFE not only improves hydrophilicity,but also reduces holes.

High Tg,high thickness/aperture radio,multiple layers boards glue for hole removal,and reliability of inner layer connectivity improved.

Ultra fine line dry film of carrier board, removing residual glue after ink development, and the qualification rate improved.

Laser drilling to remove carbon ash can improve the reliability of hole connectivity.

The rigid bending board hole removing glue can improve the consistency of etching of soft and hard board and improve the quality of hole walls.

The coarsening of the soft board before the rigid bending board is pressed can improve the bonding strength.

Precious metal pre-processing can remove surface oil stains and improve the qualification rate.

BGA and gold fingers surface oxidation removal and activation can improve the metal splashing/solderability performance.

Zhuhai Hengge Microelectronics Equipment Co., Ltd. is a high-tech enterprise focusing on the research and development, production and sales of plasma industrial application equipment, headquartered in Zhuhai.

The Group's product diversification covers three major areas.
PCB/ carrier/new energy field: vertical/horizontal /RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, the industry's first "PTH online plasma glue removal treatment system".
Traditional packaging and LED field: atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment.
Semiconductor field: silicon carbide etching, metal etching, deep silicon etching, plasma cleaning equipment, advanced packaging microwave plasma equipment.

In addition, the company provides domestic replacement solutions for high-fluorine and perfluorinated sealing rings, which are used for sealing vacuum chambers of various equipment.

The company has strong technology and research and development strength, and founded the "Plasma Equipment and Application Technology Research Center of the State Key Laboratory of Electronic Thin Film and Integrated Devices" with the University of Electronic Science and Technology of China, which has 100+ patents and won the "National high-tech Enterprise" and "Guangdong Province Specialized and special New Enterprise".

Zhuhai Henger Microelectronics Equipment Co., Ltd. is a high-tech enterprise specializing in the research and development, production, and sales of plasma industrial application equipment, with headquarter in Zhuhai. The equipment products mainly involve three business fields. PCB/Carrier Board/New Energy Field: Vertical/horizontal/RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, and industry-leading “PTH inline plasma glue removal processing system”. Traditional Packaging and LED Field: Atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment. Semiconductor Field: Silicon carbide etching, metal etching, deep silicon etching, plasma bonding removal and cleaning equipment, advanced packaging microwave plasma equipment. Meanwhile, the company supports domestic alternative solutions for high fluorine and fluoridated sealing rings, which can be applied for sealing vacuum chambers of multiple equipment. With strong technology and R&D strength, the company has established the “Plasma Equipment and Application Technology Research Center of State Key Laboratory of Electronic Thin Film and Integrated Devices” with the University of Electronic Science and Technology of China, owns over 100 patents, and wins many honors, such as “National High-tech Enterprise”, “Specialized and New Enterprise of Guangdong Province”.