SUMEC TOUCH WORLD

Application
8 inch SiC ETCH, compatible with 6 inch, Suitable for GaN, TCV, TGV process
Compatible with TSV，DRiE and other processes

Benifit
1.Higher etching rate，higher throughput
Dual RF source maximum 5KW 13.56MHz 
Bias RF maximum 3KW 13.56MHz or 400KHz 
Short Gap design, improve plasma density

2.Better Uniformity
Patented dual plasma source design with independently controlled inner and outer RF power
Specially designed with the flow channel.Characterized by a more uniform plasma distribution
Multi layer cooling pans and dual zone He coiling desigh improve temperature distribution

3.Suitable for warpage wafers
EPR(Edge protecting ring) desigh for warpage wafers
EPR prevents wafer edge etched during Deep Si Ethcing process

4. Easy maintenance, low CoC 
Heated chamber wall and shield ring(140 ℃ Max) prevent by-product deposition and improve MTBC
Plasma dry clean mode supported, improve yield and MTBC
Less consumable parts, low cost
Compact design，easy maintenance

Processing Performance
Etching rate:> 1.3um / min 
WIW Uniformity: ≤3% 
Particle add-on: <50ea 
Selectivity (to Si02):> 14:1
Good profile performance 

Zhuhai Hengge Microelectronics Equipment Co., Ltd. is a high-tech enterprise focusing on the research and development, production and sales of plasma industrial application equipment, headquartered in Zhuhai.

The Group's product diversification covers three major areas.
PCB/ carrier/new energy field: vertical/horizontal /RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, the industry's first "PTH online plasma glue removal treatment system".
Traditional packaging and LED field: atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment.
Semiconductor field: silicon carbide etching, metal etching, deep silicon etching, plasma cleaning equipment, advanced packaging microwave plasma equipment.

In addition, the company provides domestic replacement solutions for high-fluorine and perfluorinated sealing rings, which are used for sealing vacuum chambers of various equipment.

The company has strong technology and research and development strength, and founded the "Plasma Equipment and Application Technology Research Center of the State Key Laboratory of Electronic Thin Film and Integrated Devices" with the University of Electronic Science and Technology of China, which has 100+ patents and won the "National high-tech Enterprise" and "Guangdong Province Specialized and special New Enterprise".

Zhuhai Henger Microelectronics Equipment Co., Ltd. is a high-tech enterprise specializing in the research and development, production, and sales of plasma industrial application equipment, with headquarter in Zhuhai. The equipment products mainly involve three business fields. PCB/Carrier Board/New Energy Field: Vertical/horizontal/RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, and industry-leading “PTH inline plasma glue removal processing system”. Traditional Packaging and LED Field: Atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment. Semiconductor Field: Silicon carbide etching, metal etching, deep silicon etching, plasma bonding removal and cleaning equipment, advanced packaging microwave plasma equipment. Meanwhile, the company supports domestic alternative solutions for high fluorine and fluoridated sealing rings, which can be applied for sealing vacuum chambers of multiple equipment. With strong technology and R&D strength, the company has established the “Plasma Equipment and Application Technology Research Center of State Key Laboratory of Electronic Thin Film and Integrated Devices” with the University of Electronic Science and Technology of China, owns over 100 patents, and wins many honors, such as “National High-tech Enterprise”, “Specialized and New Enterprise of Guangdong Province”.