SUMEC TOUCH WORLD

Modification of Teflon material for high-frequency boards to improve hydrophilicity and reduce hole cavities;
High Tg, high thickness-to-diameter ratio, high level plate de-voiding adhesive, improve the reliability of the inner layer connection.
Ultra-fine line dry film on carrier board, remove residual adhesive after ink development, improve the qualification rate.
Laser drilling to remove carbon grey, improve the reliability of hole connection.
Rigid-flex plate to remove the hole glue, improve the consistency of the occlusion of the rigid and flexible plate materials, improve the quality of the hole wall.
Roughening of the soft plate material before press-fit, to improve the press-fit bonding force.
Pre-treatment of precious metals, remove surface oil, improve the qualification rate.
Oxidation removal and activation of BGA and gold finger surfaces to improve metal sputtering/solderability.

Zhuhai Hengge Microelectronics Equipment Co., Ltd. is a high-tech enterprise focusing on the research and development, production and sales of plasma industrial application equipment, headquartered in Zhuhai.

The Group's product diversification covers three major areas.
PCB/ carrier/new energy field: vertical/horizontal /RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, the industry's first "PTH online plasma glue removal treatment system".
Traditional packaging and LED field: atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment.
Semiconductor field: silicon carbide etching, metal etching, deep silicon etching, plasma cleaning equipment, advanced packaging microwave plasma equipment.

In addition, the company provides domestic replacement solutions for high-fluorine and perfluorinated sealing rings, which are used for sealing vacuum chambers of various equipment.

The company has strong technology and research and development strength, and founded the "Plasma Equipment and Application Technology Research Center of the State Key Laboratory of Electronic Thin Film and Integrated Devices" with the University of Electronic Science and Technology of China, which has 100+ patents and won the "National high-tech Enterprise" and "Guangdong Province Specialized and special New Enterprise".

Zhuhai Henger Microelectronics Equipment Co., Ltd. is a high-tech enterprise specializing in the research and development, production, and sales of plasma industrial application equipment, with headquarter in Zhuhai. The equipment products mainly involve three business fields. PCB/Carrier Board/New Energy Field: Vertical/horizontal/RTR plasma etching cleaning equipment, vacuum plasma etching cleaning equipment, and industry-leading “PTH inline plasma glue removal processing system”. Traditional Packaging and LED Field: Atmospheric plasma equipment, microwave plasma cleaning and glue removal equipment. Semiconductor Field: Silicon carbide etching, metal etching, deep silicon etching, plasma bonding removal and cleaning equipment, advanced packaging microwave plasma equipment. Meanwhile, the company supports domestic alternative solutions for high fluorine and fluoridated sealing rings, which can be applied for sealing vacuum chambers of multiple equipment. With strong technology and R&D strength, the company has established the “Plasma Equipment and Application Technology Research Center of State Key Laboratory of Electronic Thin Film and Integrated Devices” with the University of Electronic Science and Technology of China, owns over 100 patents, and wins many honors, such as “National High-tech Enterprise”, “Specialized and New Enterprise of Guangdong Province”.