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Post Requirements
Post Requirements
Product information
For material evaporation that is difficult to achieve with traditional thermal evaporation technology, electron beam evaporation (E-beam evaporation) can be used to achieve it. Unlike traditional radiation heating and resistance wire heating, high-energy electron beam bombardment can achieve localized high temperatures exceeding 3000 ℃, which allows most commonly used materials to evaporate, even high melting point materials such as Pt, W, Mo, Ta, as well as some oxides, ceramics, etc. The electron beam evaporation source provided by Siqi can support 1-6 different materials and achieve multi-layer film technology; The anti pollution design of the evaporation source itself minimizes cross contamination between different materials. Especially for the high temperature problem of samples in the Lift off process, the equipment is equipped with a low-temperature sample stage, which can avoid the problem of photoresist carbonization; The sample stage can be tilted to select different angles for evaporation, achieving good coverage.
Technical parameters:
1. Background vacuum of 10-7 Torr;
2. The substrate table can be customized, single or multiple pieces;
3. Number of crucibles: 1 to 6;
4. Anti pollution design for crucibles;
5. Quartz crystal oscillator for measuring film thickness;
6. The sample can be rotated and heated to: 300 ℃/500 ℃/800 ℃;
7. Can be equipped with ion beam assisted deposition;
8. Can be equipped with a rapid injection chamber;
9. Can be integrated with glove box;
10. Other coating technologies can be integrated with electron beam evaporation according to user requirements, such as magnetron sputtering, thermal evaporation, etc;
11. Fully automatic control system;
12. Optional sample stage with cooling function, suitable for lift off process;
13. Optional sample stage with adjustable tilt angle to increase the step coverage ability of the film.
