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Product information
Magnetron sputtering is a type of Physical Vapor Deposition (PVD) technology. It is generally used for preparing thin film materials such as metals, semiconductors, and insulators, and has the advantages of simple equipment, easy control, high efficiency, and large area.
Principle of Magnetron Sputtering: By introducing a magnetic field on the surface of the target cathode and using the magnetic field to constrain charged particles, the plasma density is increased to increase the sputtering rate.
Technical parameters:
1. Background vacuum: 10-7Torr to 10-9Torr;
2. Single substrate design, customizable size, standard size 2-6 inches;
3. The substrate can rotate and be heated: 300 ℃/500 ℃/800 ℃;
4. Up to 8 magnetron sputtering target guns can be expanded for co sputtering;
5. The target gun angle can be adjusted, the sputtering distance can be adjusted, and the strong magnetic target can be upgraded;
6. Multiple gas paths can be optionally configured;
7. Design of anti cross contamination partitions;
8. Can be equipped with ion beam assisted deposition;
9. Can be equipped with sample pre cleaning function;
10. Can be equipped with a rapid injection chamber;
11. Can be equipped with an automatic pressure control system;
12. Fully automated operating system;
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