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sunyuchen@sumec.com.cn
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Chemical Vapor Deposition
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SYSKEY
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Taiwan, China
Main Products:
Sputter, E-Beam, Thermal Evaporator, ALD, PEALD, RIE, PECVD, and LPCVD
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Product information

Chemical Vapor Deposition (CVD) refers to the process in which gaseous reactants undergo chemical reactions on the substrate surface at high temperatures to form thin films. It is widely used in the preparation of inorganic thin films such as metals, oxides, nitrides, and carbides. PECVD (Plasma Enhanced CVD) uses radio frequency to ionize gas and generate local plasma. The plasma activity can effectively promote the reaction, thereby reducing the reaction temperature and accelerating the film formation rate.
Technical parameters:
1. The substrate size can be customized;
2. Low temperature process:<150 ℃/350 ℃;
3. Multi layer process gas introduction with uniform gas distribution;
4. Independent MFC control box, which can flexibly expand the process gas path;
5. The uniformity of coating on the substrate is better than ± 5%;
6. Can be integrated with glove box;

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