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Product information
SYSKEY Technology has developed a PECVD&PEALD combined coating system for users, utilizing the characteristics of PEALD and PECVD coating respectively. It is used for thin film packaging, OELD thin film packaging, solar cell packaging, and thin film lithium battery packaging in semiconductor processes. ALD technology can prepare very thin and dense films, but the time required for ALD technology to prepare dense films is relatively long, which is unacceptable in industrial production. In order to overcome the disadvantage of slow coating speed of ALD, integrating it with PECVD technology for rapid preparation of dielectric thin films can achieve a thin film structure with multiple different materials alternately stacked. Practice has proven that the thin film packaging performance of this alternating structure can achieve the same packaging effect as ALD technology, while reducing the time required for the entire packaging process.
ALD
1. Stainless steel chamber with double-layer heating design;
2. The plasma enhancement module is integrated into the upper cover of the cavity;
3. High speed ALD diaphragm valve;
4. Maximum 12 inch substrate;
5. The substrate can be heated up to 400 ℃;
6. Up to 6 precursor and 6 process gases can be provided;
7. The gas path is fully sealed with metal and can be heated to 120 ℃;
8. Can provide heating or cooling for precursor steel cylinders;
9. The process can be fully controlled automatically, and manual operation is also possible.
PECVD
1. The substrate size can be customized;
2. Low temperature process:<150 ℃/350 ℃;
3. Multi layer process gas introduction with uniform gas distribution;
4. Independent MFC control box, which can flexibly expand the process gas path;
5. The uniformity of coating on the substrate is better than ± 5%;
6. Can be integrated with glove box;
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