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Reactive Ion Etching, RIE
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SYSKEY
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SYSKEY
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Taiwan, China
Main Products:
Sputter, E-Beam, Thermal Evaporator, ALD, PEALD, RIE, PECVD, and LPCVD
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Product information

Reactive Ion Etching (RIE) refers to the chemical and physical etching of a sample by applying radio frequency voltage between flat electrodes and generating plasma. Siqi Technology provides various customized RIE equipment, widely used for etching silicon oxide, silicon nitride, and various dielectric materials. In addition, Siqi can also provide inductively coupled reactive ion etching machine (ICP-RIE), which can provide higher plasma concentration and is suitable for etching other materials such as metals.


Technical parameters:
1. The substrate size can be customized;
2. Multi layer process gas introduction with uniform gas distribution;
3. Independent MFC control box, which can flexibly expand the process gas path;
4. The substrate water cooling system maintains a constant substrate temperature during etching;
5. Etching uniformity is better than ± 5%;

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