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Electron beam evaporation source
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China
Main Products:
Molecular beam epitaxy system (MBE), pulsed laser deposition system (PLD), reflective high energy electron diffractometer (RHEED), evaporation source, electron gun, ion gun, etc
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Product information

The electron beam evaporation source is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for Si Ge

270 ° deflection e-type electron gun

Single crucible capacity: 4 cc, 100 cc, 160 cc, 1000 cc;

Multiple crucibles: 3 x 15 cc, 6 x 15 cc, 6 x 8 cc

 

Flange size: DN63CF, DN250CF

Specially designed for MBE, UHV compatible, baking temperature up to 230 ℃

Ferrotec, a German company, provides high-quality multi crucible electron beam evaporation sources suitable for various customized high vacuum coating systems.

The single port horizontal installation electron beam evaporation source EBV is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for SiGe.

 

Product features:

Flange size: CF150/CF200/CF250

Crucible capacity: 40/100 cc

Filament type: W spiral coil, electron emitting filament

 

Working pressure: 1 × 10-11 mbar~1 × 10-5 mbar

Acceleration voltage: 4-10kV

Electron beam power: up to 10kW (3kW, 5kW)

Filament current: up to 50A

Beam spot size: diameter approximately 5mm

Electron beam emission method: magnetic field deflection 270 °

Beam deflection range: ± 3A in the x direction, ± 3A in the y direction

External baking temperature: 200 ℃

Cooling method: circulating water cooling, water flow rate 8l/min, pressure 3bar

Crucible: 40cm3 or 100cm3 heating area

Optional: water-cooled screen, baffle

 

The single port electron beam vertical evaporation source EBVV is designed for ultra-high vacuum equipment with vertically reserved flange ports, which can meet vertical installation requirements. Very suitable for low vapor pressure materials, refractory metals or doping, such as P, C, etc; And emerging high dielectric materials such as Al2O3, Pr3O3, or other oxides and dielectrics can also meet the growth requirements of Si thin films.

 

Product features:

Flange size: CF63/CF100

Crucible capacity: 4/5 cc

Length inside the vacuum chamber: 234-400mm

Heating port size: Ø 22mm (15 ° cone angle) x H 15mm, Ø 23mm (12 ° cone angle) x H 15mm

External baking temperature: 200 ℃

Beam spot size: diameter approximately 5mm

Beam deflection: 270 ° magnetic field deflection

Water cooling: 5l/min, pressure about 4bar

 

Optional: Shield

The multi crucible horizontal installation electron beam evaporation source EBVM is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for SiGe.

 

Product features:

Flange size: CF200/CF250

Diameter inside the cavity: 195mm/245mm

Length inside the cavity: 250mm for 4 8cc crucibles and 3 15cc crucibles; For 6 8cc crucibles: 330mm; For 6 15cc crucibles: 350mm

Crucible capacity: 8cc, 15cc

Heating area: diameter 30mm (15 ° inclination) x 15mm depth, diameter 37mm (15 ° inclination) x 17mm depth

Filament type: W spiral coil, electron emitting filament

 

External baking temperature: 200 ℃

Working pressure: 1 × 10-11 mbar~1 × 10-5 mbar

Acceleration voltage: 4-10kV

Electron beam power: up to 6kW (3kW, depending on power supply)

Filament current: up to 50A

Beam spot size: diameter approximately 5mm

Electron beam emission method: magnetic field deflection 270 °

Beam spot deflection: ± 3A in the x direction, ± 3A in the y direction

Cooling method: circulating water cooling, water flow rate 6l/min, pressure 3bar

Optional: water-cooled screen, baffle

Click to view more 'Product Categories'

 

Direct to specific products: Molecular Beam Epitaxy (MBE), Pulsed Laser Deposition (PLD), Reflective High Energy Electron Diffraction (RHEED), Evaporation Source, Ion Source, Electron Gun

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