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Product information
The electron beam evaporation source is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for Si Ge
270 ° deflection e-type electron gun
Single crucible capacity: 4 cc, 100 cc, 160 cc, 1000 cc;
Multiple crucibles: 3 x 15 cc, 6 x 15 cc, 6 x 8 cc
Flange size: DN63CF, DN250CF
Specially designed for MBE, UHV compatible, baking temperature up to 230 ℃
Ferrotec, a German company, provides high-quality multi crucible electron beam evaporation sources suitable for various customized high vacuum coating systems.
The single port horizontal installation electron beam evaporation source EBV is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for SiGe.
Product features:
Flange size: CF150/CF200/CF250
Crucible capacity: 40/100 cc
Filament type: W spiral coil, electron emitting filament
Working pressure: 1 × 10-11 mbar~1 × 10-5 mbar
Acceleration voltage: 4-10kV
Electron beam power: up to 10kW (3kW, 5kW)
Filament current: up to 50A
Beam spot size: diameter approximately 5mm
Electron beam emission method: magnetic field deflection 270 °
Beam deflection range: ± 3A in the x direction, ± 3A in the y direction
External baking temperature: 200 ℃
Cooling method: circulating water cooling, water flow rate 8l/min, pressure 3bar
Crucible: 40cm3 or 100cm3 heating area
Optional: water-cooled screen, baffle
The single port electron beam vertical evaporation source EBVV is designed for ultra-high vacuum equipment with vertically reserved flange ports, which can meet vertical installation requirements. Very suitable for low vapor pressure materials, refractory metals or doping, such as P, C, etc; And emerging high dielectric materials such as Al2O3, Pr3O3, or other oxides and dielectrics can also meet the growth requirements of Si thin films.
Product features:
Flange size: CF63/CF100
Crucible capacity: 4/5 cc
Length inside the vacuum chamber: 234-400mm
Heating port size: Ø 22mm (15 ° cone angle) x H 15mm, Ø 23mm (12 ° cone angle) x H 15mm
External baking temperature: 200 ℃
Beam spot size: diameter approximately 5mm
Beam deflection: 270 ° magnetic field deflection
Water cooling: 5l/min, pressure about 4bar
Optional: Shield
The multi crucible horizontal installation electron beam evaporation source EBVM is designed for low vapor pressure materials with high evaporation rates, especially high-purity materials and refractory materials such as Mo, Nb,Ta,W,Zr,Al, And semiconductor materials Si and Ge, typically used in MBE systems for SiGe.
Product features:
Flange size: CF200/CF250
Diameter inside the cavity: 195mm/245mm
Length inside the cavity: 250mm for 4 8cc crucibles and 3 15cc crucibles; For 6 8cc crucibles: 330mm; For 6 15cc crucibles: 350mm
Crucible capacity: 8cc, 15cc
Heating area: diameter 30mm (15 ° inclination) x 15mm depth, diameter 37mm (15 ° inclination) x 17mm depth
Filament type: W spiral coil, electron emitting filament
External baking temperature: 200 ℃
Working pressure: 1 × 10-11 mbar~1 × 10-5 mbar
Acceleration voltage: 4-10kV
Electron beam power: up to 6kW (3kW, depending on power supply)
Filament current: up to 50A
Beam spot size: diameter approximately 5mm
Electron beam emission method: magnetic field deflection 270 °
Beam spot deflection: ± 3A in the x direction, ± 3A in the y direction
Cooling method: circulating water cooling, water flow rate 6l/min, pressure 3bar
Optional: water-cooled screen, baffle
Click to view more 'Product Categories'
Direct to specific products: Molecular Beam Epitaxy (MBE), Pulsed Laser Deposition (PLD), Reflective High Energy Electron Diffraction (RHEED), Evaporation Source, Ion Source, Electron Gun
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