SUMEC TOUCH WORLD

The SPI300 geometry measurement equipment
Wafer Size Compatibility**: 4", 6", 8" compatible  
Standard configuration includes 16 cassettes or 14 cassettes (optional/WA), with all cassettes freely configurable for loading and unloading, allowing for flexible sorting.  
Inspections category: Thickness, TTV, bow, warp, TIR (Total Indicated Reading), sori, sag, LTV (requires full map inspection).  
SPI300 can output CSV data reports and allows for customized saving of line scan and area scan 2D/3D surface profile PDF reports.  

Measurement Specifications
Wafer Thickness Range: 400µm - 2000µm  
Probe Resolution: 0.028µm  
Measurement Accuracy: ±0.2µm  
Repeatability: 3σ ≤ 1.0µm  
Accuracy: THK/Bow/Warp linearity ≥ 95% , TTV/TIR linearity ≥ 90%  

Software Features
Function Blocks: Wafer handling control, status indication, safety interlock, data acquisition, wafer sorting, measurement result data viewing and storage, recipe editing and management, equipment status logging.  
User Permissions: Engineer, Operator  
Grading Function: The grading function allows user to define product grades A/B/C/NG based on their requirements.  
Parameter Definition: User can independently set inspection parameters and control standards.

Established in 2017, headquartered in Beijing, AK Optics has research and development and production bases in Beijing, Hangzhou, and Nanchang. The company was founded by senior overseas experts and is an enterprise that integrates research and development, production, sales, and service.
Focused on providing optical measurement and inspection equipment and solutions for the compound semiconductor, optoelectronic, and integrated circuit industries. Its products cover multiple aspects of production process measurement and testing in related industries, including substrate thickness and morphology measurement, substrate particle inspection, epitaxial wafer inspection, chip appearance inspection, MOCVD online monitoring, etc
Adhering to independent originality, we have accumulated and made breakthroughs in key technologies such as optical system design, optical imaging technology, and AI algorithms. We have multiple leading technologies independently developed and possess industry recognized research and development capabilities.
The company's series of wafer defect inspection equipment has been mass-produced in the fields of LED chips, compound semiconductors, and specialty process integrated circuits, and has gained market recognition.
Obtained recognition as a national high-tech enterprise, Zhongguancun high-tech enterprise, specialized and innovative small and medium-sized enterprise, and specialized and innovative "little giant" enterprise

AK Optics is based on independent originality, continuously increasing research and development investment, adhering to a pursuit of excellence, and dedicating itself to building international level wafer inspection equipment. Contribute to the localization and development of semiconductor technology. AK Optics is committed to becoming a world leading optical equipment research and manufacturing enterprise.

Having multiple independently developed leading technologies: high-resolution dual telecentric, large field of view color lens, optical system design technology, deep learning algorithm technology, defect analysis and monitoring system for various processes and equipment

The product line includes:

MOCVD in-situ Monitoring System: This product is used for real-time monitoring of wafer temperature, reflectivity, and curvature during the process, providing reliable temperature signals for precise temperature control. It is compatible with MOCVD machines of various rotational speeds. The product range includes temperature, reflectivity, and curvature online monitoring (viperRTC), surface temperature measurement (viper405), temperature calibration unit, and thermal field scanning system (Scanpyro), among others.

Inspection Equipment for LED Lighting and Display: This includes wafer morphology inspection, wafer substrate defect inspection, PSS inspection equipment, GaN and GaAs epitaxial wafer defect inspection equipment, and AOI equipment for chip appearance defect inspection. These are mainstream optical measurement and inspection devices for LED manufacturers in China.

Compound Semiconductor Substrate and Epitaxy Inspection Equipment: Mainly includes inspection equipment for second-generation semiconductors like GaAs and InP substrates and epitaxial layers, third-generation semiconductors such as GaN and SiC substrates and epitaxial layers, LT&LN inspection equipment, glass and patterned wafer inspection equipment. It features a self-developed optical system recognized by the industry, benchmarked against internationally renowned companies, with performance acknowledged within the sector.

Integrated Circuit Inspection Equipment: Focuses primarily on defect inspection of non-patterned substrates, chip inspection, CIS chips, and patterned wafer inspection.

The lead time for various inspection equipment is 4 to 6 months.