SUMEC TOUCH WORLD

Therlicon semi packaging reflow oven, make a great improvement of the performance and technique compare with the traditional soldering equipment. the main characteristic: high precise temperature control, high stability chip conveyor system, lowest oxygen content control and meet the 1000-level dust free soldering enviroment.

Shenzhen Therlicon Technology Co., Ltd. was established by the listed company JT Investment Holdings. It was registered in May 2021 with a registered capital of 20 million yuan

Based on more than 20 years of electronic thermal technology of JT, we THERLICON focus on the R&D and manu-facturing of equipment such as packaging reflow process and wafer-level ball bond-ing process in the field of semiconductor thermal engineering, and develop a full line of semiconductor thermal equipment; Including: Semiconductor Packaging Reflow Oven, Vacuum Reflow Soldering Equipment, Wafer Bumping Soldering Equipment, Flux Coater,  Formic Vacuum Reflow Oven, Dust-free Nitrogen Oven, Pressure Oven, Negative Pressure Soldering Equipment, etc. 

At present, the customers of packaging products and services involve HT-Tech, TONGFU MICROELECTRONICS, Siliconware (ASE GROUP), JCET and other well-known packaging and testing factories at home and abroad.

Based on more than 20 years of electronic thermal technology of JT, we THERLICON focus on the R&D and manu-facturing of equipment such as packaging reflow process and wafer-level ball bond-ing process in the field of semiconductor thermal engineering, and develop a full line of semiconductor thermal equipment; Including: Semiconductor Packaging Reflow Oven, Vacuum Reflow Soldering Equipment, Formic Vacuum Reflow Oven, Pressure Oven, Dust-free Nitrogen Oven, Wafer Bumping Soldering Equipment, Flux Coater, Negative Pressure Soldering Equipment, etc.