SUMEC TOUCH WORLD

The dust-free nitrogen oven adopts a hot air convection heating system, which is mainly used in the glue curing process after IGBT/SIC module packaging; the low oxygen, dust-free, segmented heating and cooling process can meet more curing process requirements.

Shenzhen Therlicon Technology Co., Ltd. was established by the listed company JT Investment Holdings. It was registered in May 2021 with a registered capital of 20 million yuan

Based on more than 20 years of electronic thermal technology of JT, we THERLICON focus on the R&D and manu-facturing of equipment such as packaging reflow process and wafer-level ball bond-ing process in the field of semiconductor thermal engineering, and develop a full line of semiconductor thermal equipment; Including: Semiconductor Packaging Reflow Oven, Vacuum Reflow Soldering Equipment, Wafer Bumping Soldering Equipment, Flux Coater,  Formic Vacuum Reflow Oven, Dust-free Nitrogen Oven, Pressure Oven, Negative Pressure Soldering Equipment, etc. 

At present, the customers of packaging products and services involve HT-Tech, TONGFU MICROELECTRONICS, Siliconware (ASE GROUP), JCET and other well-known packaging and testing factories at home and abroad.

Based on more than 20 years of electronic thermal technology of JT, we THERLICON focus on the R&D and manu-facturing of equipment such as packaging reflow process and wafer-level ball bond-ing process in the field of semiconductor thermal engineering, and develop a full line of semiconductor thermal equipment; Including: Semiconductor Packaging Reflow Oven, Vacuum Reflow Soldering Equipment, Formic Vacuum Reflow Oven, Pressure Oven, Dust-free Nitrogen Oven, Wafer Bumping Soldering Equipment, Flux Coater, Negative Pressure Soldering Equipment, etc.