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Wafer handling EFEM: 6 "/8" SMIF or 12 "FOUP
Wafer type: opaque wafers, such as bare silicon wafers, oxides, nitrides, etc
Wafer warpage not exceeding 100um
Wafer thickness 350um~1.5mm (bottom absorb or edge clamp)
oblique incidence dark field, DIC bright field
Non-patterned wafer particle inspection sensitivity 51nm
Defect inspection classification: Particle, scratch, pit, bump, Haze map
Process Node 90-130nm
/OCR: OCR, recognition rate ≥ 99% (compliant with SEMI font standards, except for unclear engraving)
/IV: Offline image viewing software that can be used for offline analysis
/SG: SECS-GEM, supports SEMI automation standard SECS/GEM communication interface, complies with SEMI E5- (SECS-II), SEMI E30- (GEM), SEMI E37- (HSMS) communication standards, and retains other communication protocol interfaces
/PSL: PSL Si standard wafer











![[Second-hand] laser](https://cdn.sumecdtx.com/equipment/20230818/928f9346aceb42e3b60670c380399f59.jpg)



