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F2000 Particle counter
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Product information

Wafer handling EFEM: 6 "/8" SMIF or 12 "FOUP

Wafer type: opaque wafers, such as bare silicon wafers, oxides, nitrides, etc

Wafer warpage not exceeding 100um

Wafer thickness 350um~1.5mm (bottom absorb or edge clamp)

oblique incidence dark field, DIC bright field

Non-patterned wafer particle inspection sensitivity 51nm

Defect inspection classification: Particle, scratch, pit, bump, Haze map

Process Node 90-130nm

/OCR: OCR, recognition rate ≥ 99% (compliant with SEMI font standards, except for unclear engraving)

/IV: Offline image viewing software that can be used for offline analysis

/SG: SECS-GEM, supports SEMI automation standard SECS/GEM communication interface, complies with SEMI E5- (SECS-II), SEMI E30- (GEM), SEMI E37- (HSMS) communication standards, and retains other communication protocol interfaces

/PSL: PSL Si standard wafer

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