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Product information
SM Semiconductor Series
Semiconductor consumables processing equipment - High productivity response and complete product lineup, comprehensively occupying the niche market.
Product Introduction of SMG600H
High-speed, high-precision, bidirectional grinding center
The SM series products have absorbed the essence of machine tool manufacturing technology for semiconductor processing consumables. The advantages of this equipment in high-precision and batch production make it an ideal choice for the semiconductor industry.
Main shaft
The spindle power of 7.5/11/15/18.5 kW meets various processing requirements. It reduces thermal displacement during high-speed operation, making it suitable for the semiconductor processing field with high precision and quality demands.
2. X-axis
The X-axis travel is 410 mm (16.14"), capable of processing complex and large workpieces.
3. Z-axis
The Z-axis stroke is 230 mm (9.06").
4. Bidirectional grinding function
Grinding speed: 0 - 2,500 rpm, offering faster cycle times and higher grinding accuracy, enhancing work efficiency and suitable for mass production. Worktable flatness ≤ 3 µm, ensuring uniform grinding and superior surface finish.
5. Others
The grinding wheel and the worktable spindle speed are automatically adjusted to ensure consistent surface roughness of the processed parts. The high-precision bearing system, pre-stretched large-diameter ball screws and P4 grade precision bearings guarantee rigidity and thermal stability. The intelligent operation interface, with GUI program support, enables simple parameter input without complex programming.
II. Applications in the Semiconductor Industry
Processing of SiC (Silicon Carbide) substrates:
It can efficiently process SiC materials with a diameter of Ø380 mm and a thickness of 9 mm, and is an important device for semiconductor substrate processing.
2. Wafer Manufacturing:
It offers ultra-high flatness and smoothness, and can be used for wafer surface treatment, supporting the next photolithography process.
3. Precision parts manufacturing:
Precision component processing for semiconductor equipment, such as brackets, cavities and other high-precision requirement components.
4. Research and Development and Prototype Testing:
Highly flexible programming and multi-functional options make it suitable for semiconductor process development and new product trials.
The advantages of this equipment in high-precision and batch production make it an ideal choice for the semiconductor industry.
III. Global Universal FANUC System
The SMG600 machine tool is equipped with a Fanuc control system and a user-friendly GUI interface, lowering the operation threshold. It features comprehensive processing functions, convenient operation, and enhanced productivity. 90-degree flip
