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Main features:
Space-saving design and small footprint;
Mostly usedCutting large size square sheet materials and small size multiple sheets;
Customized spindle with higher power, strong cutting force;
▏Adopt advanced wizard-type touch screen to control the GUI interface;
▏Intelligent network control system with high reliability and high cutting efficiency;
Advanced functions:
Cutting function of multiple graphic workpieces on the same plate;
Various complex cutting functions;
Automatic image recognition and alignment function;
Real-time display and early warning function of blade exposure;
Vacuum early warning function, vacuum pipeline water removal function;
Centralized refueling, rapid maintenance function;
Cutting, blade database management, operation logging.
Application:
Precision cutting of 8-inch blue glass, silicon wafer, gallium arsenide, lithium niobate, aluminum oxide, ceramics, quartz, sapphire, crystals, PCB boards, zinc cadmium telluride CZT and other materials; widely used in optical optoelectronic, communications, transistors, IC, LED, NTC, photovoltaic, medical equipment, scintillation crystals and other industries.
Other characteristics:
Fault alarms for low air pressure, water pressure, workbench servo, turntable servo, spindle drive, height measuring system, and control system, operation door safety lock, water leakage detection, spindle current monitoring, and vacuum insufficient protection functions.
Technical indicators:













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