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Post Requirements
Post Requirements
Product information
Main features:
The maximum effective processing size is 6 inches, and special workbench and cutting frame can be customized;
▏Configure multi-piece automatic cutting function;
▏Adopt advanced wizard-type touch screen to control the GUI interface;
▏Intelligent network control system with high reliability and high cutting efficiency;
Advanced functions:
Cutting function of multiple graphic workpieces on the same plate;
Various complex cutting functions;
Automatic image recognition and alignment function;
Automatic process sharpening function;
Double-rate microscope switching function;
Vacuum early warning function, vacuum pipeline water removal function;
Centralized refueling, rapid maintenance function;
Cutting, blade database management, operation logging.
Application:
Precision cutting of 6-inch silicon wafers, ceramics, PCB boards, EMC, quartz, glass, gallium arsenide, lithium niobate, cadmium zinc telluride CZT and other materials; widely used in IC integrated circuits, LED gallium arsenide chips, diodes, transistors, LED packaging, NTC, MEMS, IC, photovoltaic, medical equipment, scintillation crystals and other industries.
Other characteristics:
Fault alarms for low air pressure, water pressure, workbench servo, turntable servo, spindle drive, height measuring system, and control system, safety lock for operating chamber door, water leakage detection, spindle current monitoring, and vacuum insufficient protection functions.
Technical indicators:
![[Second-hand] laser](https://cdn.sumecdtx.com/equipment/20230818/928f9346aceb42e3b60670c380399f59.jpg)
