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Post Requirements
Post Requirements
Product information
Main features:
▏Large size cutting and processing, the maximum processing size is 300mm × 300mm;
▏Select a special cutting frame and workbench to cut multiple pieces of products on large packaging substrates.
Main functional configuration:
☑ Match with a variety of imported air spindles (compatible with currently common short shafts), and optionally install a 2.4KW high-torque spindle;
☑ Non-contact height measurement (NCS) is standard;
☑ Optional blade damage detection (BBD);
☑ The theta axis adopts direct-drive DD motor with high precision and fast speed;
☑ Two sets of high and low power microscope systems realize high-speed image recognition functions, multiple alignment modes, fast edge finding, and greatly improve efficiency.
Application:
Precision cutting of 12-inch IC, PCB, ceramics, glass, lithium niobate, aluminum oxide, quartz, zinc cadmium telluride CZT and other materials; widely used in IC integrated circuits (8-12-inch), LED packaging, QFN, DFN, BGA, optical optoelectronic, communications and other industries.
Advanced functions:
☑ Multi-point automatic recognition algorithm solves the problem of inaccurate markings caused by frame deformation and achieves accurate processing;
☑ Multi-piece processing, by optimizing the customized workbench and frame, the device can be clamped and processed more pieces at one time.
Technical indicators:
![[Second-hand] laser](https://cdn.sumecdtx.com/equipment/20230818/928f9346aceb42e3b60670c380399f59.jpg)
