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Stealth Dicing Machine
Price：
price negotiable
Brand Name：
Hai JiexingCountry Region：
ChinaModel No：
YQ1211
Post Requirements
Hai Jiexing 
Country： China
Main Products： Laser cutting of wafer
View more
Price：
price negotiable
Brand Name：
Hai JiexingCountry Region：
ChinaModel No：
YQ1211
Post RequirementsHai Jiexing 
China
Main Products：
Laser cutting of wafer
Product information
Applicable materials: AI, MEMS, silicon optical (SiPh), silicon carbide (SiC), lithium tantalate (LiTaO) and other wafers are fully cut
Core advantages:
Dry machining: No cooling water and tools, reduce the cost of consumables, green and environmentally friendly
Efficient cutting: * High processing speed reaches 1000mm/s, significantly improving production capacity
All products in the store
Laser Grooving Machine
Stealth Dicing Machine
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