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Post Requirements
Product information
Fully automatic wafer debonding equipment
Origin: China
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Introduction (Description):
Debonding is a technique that separates the wafer from the carrier after thinning polishing is completed. Debonding is carried out according to processes such as warpage correction, pyrolytic slip and wafer cleaning. After temporary bonding, the bond sheet is often subjected to processes such as back thinning and polishing or coating. These processes not only reduce the wafer thickness to about 100 μm, but also introduce mechanical and thermal stresses, causing severe warping of the wafer. Therefore, before debonding, warpage correction must be carried out on the thin wafer. Otherwise, during subsequent heating and sliding debonding, the wafer will be damaged and fragmented due to excessive deformation and uneven stress. The fully automatic wafer debonding equipment independently developed by Lianghuo Semiconductor has completely overcome these problems in traditional processes. It has passed the certification of a large factory and entered the mass production line.
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Equipment Specifications (Specifications):
1. Support 6-8 inch wafer;2. Hot slip debonding;3. Heating temperature RT-350℃;4. Temperature accuracy ±1.5℃;5. Capacity: WPH≥10.









![[Used] laser](https://cdn.sumecdtx.com/equipment/20230818/928f9346aceb42e3b60670c380399f59.jpg)









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