SUMEC TOUCH WORLD

Chip Saultech and Die Bonder products are applied in LED, LD, IC and Lens Backend / Assembly Process. Under the existing pick-and-place technology framework, we continue to extend cooperation with customers, distributors and peers to develop various innovative and cost-effective equipment, aiming to become a world-class product and technology provider. Saultech Technology is committed to precision equipment R & D, manufacturing, sales and customer satisfaction services. Pursue excellent quality, all colleagues pay attention to every detail of the work project, constantly improve the internal process, to achieve zero defects in everything as the goal. When any quality defect of the company has not completely disappeared, all colleagues are willing to take various remedial measures or after-sales service together, so that customers do not feel any poor quality or defects.