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Main Products : Crystal oscillation manufacturing equipment

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Semiconductor equipment
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Flip-Chip Bonder for Small-sized Device
Price
price negotiable
Country
Japan

Thermal Inspection Equipment for Pressure Sensors
Price
price negotiable
Country
Japan

High speed Blank Mounter for Crystal Blank
Price
price negotiable
Country
Japan

Indentation Inspection Equipment(AOI)
Price
price negotiable
Country
Japan

Ultrasonic Bump Bonder
Price
price negotiable
Country
Japan

MEMS Sensor-Element Assembly Equipment
Price
price negotiable
Country
Japan

Frequency Measuring Instrument(Wafer Prober)
Price
price negotiable
Country
Japan

Side Fill Dispenser
Price
price negotiable
Country
Japan

Thermistor Mounter
Price
price negotiable
Country
Japan

Laser Trimming Equipment
Price
price negotiable
Country
Japan

Active Alignment Equipment for Dual Camera
Price
price negotiable
Country
Japan

Clean Curing Oven for Crystal Device
Price
price negotiable
Country
Japan

Temperature Test Equipment
Price
price negotiable
Country
Japan

Lens Inserter
Price
price negotiable
Country
Japan

4-Head Multi-Clean Dispenser
Price
price negotiable
Country
Japan

Gloss-leak Inspection Equipment
Price
price negotiable
Country
Japan

Active Alignment Equipment for Camera
Price
price negotiable
Country
Japan

Temperature Test Equipment for DIP-Inspection
Price
price negotiable
Country
Japan

Final Inspection Taping Equipment
Price
price negotiable
Country
Japan

TCXO Inline Temperature Test Equipment
Price
price negotiable
Country
Japan
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