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Global Trading Service Platform for Machinery

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中文
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+86 25-84532303
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sunyuchen@sumec.com.cn
SHINKAWA LTD.
SHINKAWA LTD.
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Japan
Image Quality partner
Image Time of Registration : 1 Years
Image industry experience : 5 Years
ImageREG : 1 Years
ImageEXP : 5 Years
Main Products : Wire Bonder、Die Bonder
Image Post Requirements
SHINKAWA LTD.
Product Categories
All products
Semiconductor equipment
All products
High Speed Au Wire Bonder for LED and discrete
High Speed Au Wire Bonder for LED and discrete
Price
price negotiable
Country
Japan
TCB Flip Chip Bonder for Chip to Substrate
TCB Flip Chip Bonder for Chip to Substrate
Price
price negotiable
Country
Japan
High-Accuracy Die Bonder with Advanced Pick-Up
High-Accuracy Die Bonder with Advanced Pick-Up
Price
price negotiable
Country
Japan
Wide-area Adaptive High-speed Wafer Bump Bonder
Wide-area Adaptive High-speed Wafer Bump Bonder
Price
price negotiable
Country
Japan
Dual TCB Flip Chip Bonder for Chip to Wafer
Dual TCB Flip Chip Bonder for Chip to Wafer
Price
price negotiable
Country
Japan
TCB Flip Chip Bonder for C2S and C2W
TCB Flip Chip Bonder for C2S and C2W
Price
price negotiable
Country
Japan
TCB Flip Chip Bonder for Chip to Wafer
TCB Flip Chip Bonder for Chip to Wafer
Price
price negotiable
Country
Japan
High-speed Au wire bonder
High-speed Au wire bonder
Price
price negotiable
Country
Japan
High-Speed&High-Accuracy Die Bonder for small chip
High-Speed&High-Accuracy Die Bonder for small chip
Price
price negotiable
Country
Japan
High-speed Cu wire bonder
High-speed Cu wire bonder
Price
price negotiable
Country
Japan
High-speed Cu wire bonder for wide frames
High-speed Cu wire bonder for wide frames
Price
price negotiable
Country
Japan
Ultra High Speed C4/C2 Flip Chip Bonder
Ultra High Speed C4/C2 Flip Chip Bonder
Price
price negotiable
Country
Japan
High-Speed&High-Accuracy Die Bonder for small chip
High-Speed&High-Accuracy Die Bonder for small chip
Price
price negotiable
Country
Japan
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