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SHINKAWA LTD.  is made up ofYamaha Intelligent Machinery Holdings Co., Ltd. 100% investment. It was established on July 1, 2019. Its headquarters address is 2-51-1 Inaira, Musashimurayama, Tokyo, Japan. It has a registered capital of 100 million yen (yen) and its legal representative is Fumihiko Ooka. Based on the core technology of "connection",SHINKAWA LTD. provides various bonding equipment solutions, such as chip bonding (DB), wire bonding (WB), flip chip bonding (FC), etc., which connect semiconductor chips and substrates.It is amazing to develop ultra-precision and ultra-high-speed technology in a microscopic world that cannot be confirmed by the naked eye. On the other hand, the precision and high integration of semiconductors are also constantly developing in the direction of smaller, thinner and lighter.Guided by technological trends and customer needs, SHINKAWA LTD. has built a development, design and production system that is conducive to innovative products. From marketing activities to product development, sales, and after-sales technical support, we always implement customer first and provide fast and meticulous services. The operating companies supporting Yamaha Intelligent Machinery Holdings Co., Ltd. combine their advantages in "connection","curing","cutting","assembly" and "diagnosis" with "transportation" technology to create machines and equipment solutions that are easy to use and achieve stable production. Its company's goal is to provide customer-friendly equipment solutions, achieve stable production, and pursue high-quality, high-performance manufacturing.
SHINKAWA LTD.  considers developing products from a global perspective and manufactures equipment that is trusted by users around the world!

In 2019, Yamaha Engine converted a large semiconductor Wire Bonder company into a subsidiary through a third-party capital increase. As a leading company in semiconductor manufacturing equipment, SHINKAWA LTD.  has always been at the forefront of technology. Semiconductors support the development of the industry, and SHINKAWA LTD. is an indispensable manufacturer in manufacturing semiconductors.SHINKAWA LTD. has always developed its business around Wire Bonder.Bonding equipment provides a precise and fast operating environment within 1/1000 mm. The precision and high integration of semiconductors are also constantly developing in the direction of becoming smaller, thinner and lighter. We introduce industry-leading image recognition, digital signal processing and other technologies, and are always at the forefront of industry technology!

Shinkawa SheyouYamaha Intelligent Machinery Holdings Co., Ltd. 100% investment. In July 2019, Yamaha Engine Company, SHINKAWA LTD.and APIC Yamada Company merged their businesses to form Yamaha Intelligent Machinery Holdings Co., Ltd.(formerly Yamaha Engine Company), a holding company with Yamaha Engines as its parent company. With Shinkawa Corporation, which develops, manufactures and sells semiconductor manufacturing equipment, APIC Yamada Corporation and PFA Corporation are operations of Yamaha Robotics Holdings. As semiconductors and electronic components become smaller and thinner, they need to have higher performance, and new demands are increasing, such as high integration and heterogeneous integration, which is difficult to produce with traditional production processes. Shinkawa provides a variety of manufacturing equipment for semiconductor back-end processes and, together with Yamaha engines 'surface-mount processes and industrial robot solutions, serves as a "total solution provider from Japan" to meet the diverse needs of semiconductor and electronic component production.
SHINKAWA LTD.  has introduced industry-leading image recognition, digital signal processing and other technologies, and has always been at the forefront of industry technology!