SHINKAWA LTD.

Main Products : Wire Bonder、Die Bonder

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Semiconductor equipment
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High Speed Au Wire Bonder for LED and discrete
Price
price negotiable
Country
Japan

TCB Flip Chip Bonder for Chip to Substrate
Price
price negotiable
Country
Japan

High-Accuracy Die Bonder with Advanced Pick-Up
Price
price negotiable
Country
Japan

Wide-area Adaptive High-speed Wafer Bump Bonder
Price
price negotiable
Country
Japan

Dual TCB Flip Chip Bonder for Chip to Wafer
Price
price negotiable
Country
Japan

TCB Flip Chip Bonder for C2S and C2W
Price
price negotiable
Country
Japan

TCB Flip Chip Bonder for Chip to Wafer
Price
price negotiable
Country
Japan

High-speed Au wire bonder
Price
price negotiable
Country
Japan

High-Speed&High-Accuracy Die Bonder for small chip
Price
price negotiable
Country
Japan

High-speed Cu wire bonder
Price
price negotiable
Country
Japan

High-speed Cu wire bonder for wide frames
Price
price negotiable
Country
Japan

Ultra High Speed C4/C2 Flip Chip Bonder
Price
price negotiable
Country
Japan

High-Speed&High-Accuracy Die Bonder for small chip
Price
price negotiable
Country
Japan
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